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+8618924632110（Bella)
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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ICM-328-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 28P |
789 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
ICM-632-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 32P |
988 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
110-44-316-41-001000CONN IC DIP SOCKET 16POS TIN |
1,448 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
110-87-316-41-001101CONN IC DIP SOCKET 16POS GOLD |
2,092 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
4840-6004-CPCONN IC DIP SOCKET 40POS TIN |
2,195 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
110-87-422-41-001101CONN IC DIP SOCKET 22POS GOLD |
877 |
|
Datasheet |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
10-0518-10CONN SOCKET SIP 10POS GOLD |
650 |
|
Datasheet |
518 | Bulk | Active | SIP | 10 (1 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
14-3518-10CONN IC DIP SOCKET 14POS GOLD |
614 |
|
Datasheet |
518 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
SA246040CONN IC DIP SOCKET 24POS GOLD |
108 |
|
Datasheet |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Thermoplastic, Polyester, Glass Filled | 80.0µin (2.03µm) | Brass |
|
210-1-18-003CONN IC DIP SOCKET 18POS GOLD |
3,716 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 200.0µin (5.08µm) | Brass |
|
4848-6000-CPCONN IC DIP SOCKET 48POS TIN |
155 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
SA283000CONN IC DIP SOCKET 28POS TIN |
945 |
|
Datasheet |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
54020-32030LFCONN SOCKET PLCC 32POS TIN |
5,991 |
|
Datasheet |
- | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | 100.0µin (2.54µm) | Copper Alloy |
|
A-CCS 032-Z-TCONN SOCKET PLCC 32POS TIN |
2,533 |
|
Datasheet |
- | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 160.0µin (4.06µm) | Phosphor Bronze |
|
|
110-47-316-41-001000CONN IC DIP SOCKET 16POS GOLD |
562 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
A-CCS 028-Z-TCONN SOCKET PLCC 28POS TIN |
764 |
|
Datasheet |
- | Tube | Active | PLCC | 28 (4 x 7) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 160.0µin (4.06µm) | Phosphor Bronze |
|
4848-6004-CPCONN IC DIP SOCKET 48POS TIN |
471 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
110-44-318-41-001000CONN IC DIP SOCKET 18POS TIN |
3,196 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
110-99-318-41-001000CONN IC DIP SOCKET 18POS TINLEAD |
688 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
ICM-642-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 42P |
305 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
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