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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    123-83-308-41-001101

    123-83-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    		 2,414
    RFQ
    		123-83-308-41-001101

    Datasheet

         		123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    8420-21B1-RK-TP

    8420-21B1-RK-TP

    CONN SOCKET PLCC 20POS TIN

    3M

    		 3,538
    RFQ
    		8420-21B1-RK-TP

    Datasheet

         		8400 Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    20-3518-10

    20-3518-10

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 511
    RFQ
    		20-3518-10

    Datasheet

         		518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-3518-11

    08-3518-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 225
    RFQ
    		08-3518-11

    Datasheet

         		518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    A-CCS 052-Z-T

    A-CCS 052-Z-T

    IC SOCKET PLCC 52POS TIN

    Assmann WSW Components

    		 1,119
    RFQ
    		A-CCS 052-Z-T

    Datasheet

         		- Tube Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    110-41-314-41-001000

    110-41-314-41-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 810
    RFQ
    		110-41-314-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    D2899-42

    D2899-42

    CONN IC DIP SOCKET 3POS GOLD

    Harwin Inc.

    		 773
    RFQ
    		D2899-42

    Datasheet

         		D2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 3 (1 x 3), 2 Loaded 0.200" (5.08mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.200" (5.08mm) Tin 196.9µin (5.00µm) Brass Polyamide (PA), Nylon, Glass Filled -55°C ~ 125°C
    8428-21B1-RK-TP

    8428-21B1-RK-TP

    CONN SOCKET PLCC 28POS TIN

    3M

    		 2,470
    RFQ
    		8428-21B1-RK-TP

    Datasheet

         		8400 Tube Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    8428-11B1-RK-TP

    8428-11B1-RK-TP

    CONN SOCKET PLCC 28POS TIN

    3M

    		 862
    RFQ
    		8428-11B1-RK-TP

    Datasheet

         		8400 Tube Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-44-624-41-001000

    110-44-624-41-001000

    CONN IC DIP SOCKET 24POS TIN

    Mill-Max Manufacturing Corp.

    		 2,598
    RFQ
    		110-44-624-41-001000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-324-41-001000

    110-44-324-41-001000

    CONN IC DIP SOCKET 24POS TIN

    Mill-Max Manufacturing Corp.

    		 900
    RFQ
    		110-44-324-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    SA286000

    SA286000

    CONN IC DIP SOCKET 28POS GOLD

    On Shore Technology Inc.

    		 593
    RFQ
    		SA286000

    Datasheet

         		SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    D2820-42

    D2820-42

    CONN IC DIP SOCKET 20POS GOLD

    Harwin Inc.

    		 8,261
    RFQ
    		D2820-42

    Datasheet

         		D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
    18-3518-10

    18-3518-10

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 391
    RFQ
    		18-3518-10

    Datasheet

         		518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICM-648-1-GT-HT

    ICM-648-1-GT-HT

    MACHINE PIN SOCKET, IC, DIP, 48P

    Adam Tech

    		 729
    RFQ
    		ICM-648-1-GT-HT

    Datasheet

         		ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    110-87-324-41-001101

    110-87-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    		 1,421
    RFQ
    		110-87-324-41-001101

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    8432-11B1-RK-TP

    8432-11B1-RK-TP

    CONN SOCKET PLCC 32POS TIN

    3M

    		 627
    RFQ
    		8432-11B1-RK-TP

    Datasheet

         		8400 Tube Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 32-HZL/01-TT

    AR 32-HZL/01-TT

    CONN IC DIP SOCKET 32POS GOLD

    Assmann WSW Components

    		 1,868
    RFQ
    		AR 32-HZL/01-TT

    Datasheet

         		- Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    PLCC-68-AT-SMT

    PLCC-68-AT-SMT

    CONN SOCKET PLCC 68POS PHOS BRNZ

    Adam Tech

    		 1,421
    RFQ
    		PLCC-68-AT-SMT

    Datasheet

         		PLCC Tube Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    110-47-624-41-001000

    110-47-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 291
    RFQ
    		110-47-624-41-001000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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