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+8618924632110（Bella)
+8618924632110（Bella)
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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-87-632-41-105101CONN IC DIP SOCKET 32POS GOLD |
1,054 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
299-87-310-10-001101CONN IC DIP SOCKET 10POS GOLD |
282 |
|
Datasheet |
299 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
110-44-648-41-001000CONN IC DIP SOCKET 48POS TIN |
151 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
110-83-328-41-001101CONN IC DIP SOCKET 28POS GOLD |
195 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
940-44-084-24-000000CONN SOCKET PLCC 84POS TIN |
186 |
|
Datasheet |
940 | Tube | Active | PLCC | 84 (4 x 21) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
D01-9973242CONN SOCKET SIP 32POS GOLD |
5,378 |
|
Datasheet |
D01-997 | Tube | Active | SIP | 32 (1 x 32) | Gold | Flash | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 196.9µin (5.00µm) | Brass |
|
110-41-632-41-001000CONN IC DIP SOCKET 32POS GOLD |
723 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
18-6513-10CONN IC DIP SOCKET 18POS GOLD |
139 |
|
Datasheet |
Lo-PRO®file, 513 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
A-CCS 068-G-TCONN SOCKET PLCC 68POS GOLD |
387 |
|
Datasheet |
- | Tube | Active | PLCC | 68 (4 x 17) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
110-93-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
479 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
110-93-328-41-001000CONN IC DIP SOCKET 28POS GOLD |
435 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
210-43-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
775 |
|
Datasheet |
210 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
210-93-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
575 |
|
Datasheet |
210 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
XR2C-2011-NCONN SOCKET SIP 20POS GOLD |
142 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 20 (1 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
110-13-320-41-001000CONN IC DIP SOCKET 20POS GOLD |
243 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
A-CCS 084-G-TCONN SOCKET PLCC 84POS GOLD |
205 |
|
Datasheet |
- | Tube | Active | PLCC | 84 (4 x 21) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
110-87-640-41-001101CONN IC DIP SOCKET 40POS GOLD |
1,037 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
38340-PIN ZIF SOCKET |
110 |
|
Datasheet |
- | - | Active | DIP, ZIF (ZIP) | 40 (2 x 20) | Gold | - | - | Through Hole | Closed Frame | - | Solder | - | - | Gold | - | - | - |
|
|
110-93-632-41-001000CONN IC DIP SOCKET 32POS GOLD |
363 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
210-93-632-41-001000CONN IC DIP SOCKET 32POS GOLD |
564 |
|
Datasheet |
210 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
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