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+8618924632110（Bella)
+8618924632110（Bella)
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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
117-87-764-41-005101CONN IC DIP SOCKET 64POS GOLD |
443 |
|
Datasheet |
117 | Tube | Active | DIP, 0.75" (19.05mm) Row Spacing | 64 (2 x 32) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
110-13-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
148 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
25-0511-10CONN SOCKET SIP 25POS TIN |
379 |
|
Datasheet |
511 | Tube | Active | SIP | 25 (1 x 25) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 50.0µin (1.27µm) | Phosphor Bronze |
|
299-93-314-10-001000CONN IC DIP SOCKET 14POS GOLD |
152 |
|
Datasheet |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
10-2820-90CCONN IC DIP SOCKET 10POS GOLD |
368 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
14-820-90TCONN IC DIP SOCKET 14POS TIN |
264 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Phosphor Bronze |
|
299-43-610-10-002000CONN IC DIP SOCKET 10POS GOLD |
165 |
|
Datasheet |
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
110-43-964-41-001000CONN IC DIP SOCKET 64POS GOLD |
103 |
|
Datasheet |
110 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
10-2810-90CONN IC DIP SOCKET 10POS GOLD |
500 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Phosphor Bronze |
|
14-810-90CONN IC DIP SOCKET 14POS GOLD |
573 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Phosphor Bronze |
|
299-43-320-10-001000CONN IC DIP SOCKET 20POS GOLD |
173 |
|
Datasheet |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
2041549-1SOCKET ASSY, DMD 350, T/R, G/F |
442 |
|
Datasheet |
DMD | Tape & Reel (TR) | Active | PGA, ZIF (ZIP) | 350 (35 x 36) | Gold | Flash | Copper Alloy | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 105°C | Tin-Lead | Liquid Crystal Polymer (LCP), Glass Filled | - | Copper Alloy |
|
28-526-10CONN IC DIP SOCKET ZIF 28POS TIN |
200 |
|
Datasheet |
Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
TCC05DCSN-S1403CONN TRANSIST TO-220/TO-247 5POS |
102 |
|
Datasheet |
- | Tray | Active | Transistor, TO-220 and TO-247 | 5 (Rectangular) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | - | Solder | - | -65°C ~ 175°C | Gold | Polyphenylene Sulfide (PPS) | 30.0µin (0.76µm) | Beryllium Copper |
|
110-43-308-41-105000CONN IC DIP SOCKET 8POS GOLD |
119 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
32-6554-10CONN IC DIP SOCKET ZIF 32POS TIN |
216 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
32-6554-11CONN IC DIP SOCKET ZIF 32POS GLD |
165 |
|
Datasheet |
55 | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyphenylene Sulfide (PPS), Glass Filled | - | Beryllium Copper |
|
1-2324271-3RIGHT SEGMEN LGA4189-4 SOCKET-P4 |
4,159 |
|
Datasheet |
- | Tray | Active | LGA 4189 | 2092 | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | 0.039" (1.00mm) | Solder | 0.034" (0.86mm) | -25°C ~ 100°C | Gold | Thermoplastic | 15.0µin (0.38µm) | Copper Alloy |
|
714-43-264-31-018000CONN IC DIP SOCKET 64POS GOLD |
129 |
|
Datasheet |
714 | Tube | Active | DIP, 0.1" (2.54mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 30.0µin (0.76µm) | Brass Alloy |
|
|
1-2324271-2LEFT SEGMEN LGA4189-4 SOCKET-P4 |
3,756 |
|
Datasheet |
- | Tray | Active | LGA 4189 | 2092 | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | 0.039" (1.00mm) | Solder | 0.034" (0.86mm) | -25°C ~ 100°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Copper Alloy |
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