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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    117-87-764-41-005101

    117-87-764-41-005101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    		 443
    RFQ
    		117-87-764-41-005101

    Datasheet

         		117 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-13-640-41-001000

    110-13-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    		 148
    RFQ
    		110-13-640-41-001000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    25-0511-10

    25-0511-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    		 379
    RFQ
    		25-0511-10

    Datasheet

         		511 Tube Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-93-314-10-001000

    299-93-314-10-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 152
    RFQ
    		299-93-314-10-001000

    Datasheet

         		299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    10-2820-90C

    10-2820-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 368
    RFQ
    		10-2820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-820-90T

    14-820-90T

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    		 264
    RFQ
    		14-820-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    299-43-610-10-002000

    299-43-610-10-002000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    		 165
    RFQ
    		299-43-610-10-002000

    Datasheet

         		299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-964-41-001000

    110-43-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 103
    RFQ
    		110-43-964-41-001000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    10-2810-90

    10-2810-90

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 500
    RFQ
    		10-2810-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    14-810-90

    14-810-90

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 573
    RFQ
    		14-810-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    299-43-320-10-001000

    299-43-320-10-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 173
    RFQ
    		299-43-320-10-001000

    Datasheet

         		299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    2041549-1

    2041549-1

    SOCKET ASSY, DMD 350, T/R, G/F

    TE Connectivity AMP Connectors

    		 442
    RFQ
    		2041549-1

    Datasheet

         		DMD Tape & Reel (TR) Active PGA, ZIF (ZIP) 350 (35 x 36) 0.050" (1.27mm) Gold Flash Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead - Copper Alloy Liquid Crystal Polymer (LCP), Glass Filled -55°C ~ 105°C
    28-526-10

    28-526-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    		 200
    RFQ
    		28-526-10

    Datasheet

         		Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    TCC05DCSN-S1403

    TCC05DCSN-S1403

    CONN TRANSIST TO-220/TO-247 5POS

    Sullins Connector Solutions

    		 102
    RFQ
    		TCC05DCSN-S1403

    Datasheet

         		- Tray Active Transistor, TO-220 and TO-247 5 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 175°C
    110-43-308-41-105000

    110-43-308-41-105000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 119
    RFQ
    		110-43-308-41-105000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6554-10

    32-6554-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 216
    RFQ
    		32-6554-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6554-11

    32-6554-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 165
    RFQ
    		32-6554-11

    Datasheet

         		55 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    1-2324271-3

    1-2324271-3

    RIGHT SEGMEN LGA4189-4 SOCKET-P4

    TE Connectivity AMP Connectors

    		 4,159
    RFQ
    		1-2324271-3

    Datasheet

         		- Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -25°C ~ 100°C
    714-43-264-31-018000

    714-43-264-31-018000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 129
    RFQ
    		714-43-264-31-018000

    Datasheet

         		714 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    1-2324271-2

    1-2324271-2

    LEFT SEGMEN LGA4189-4 SOCKET-P4

    TE Connectivity AMP Connectors

    		 3,756
    RFQ
    		1-2324271-2

    Datasheet

         		- Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -25°C ~ 100°C
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