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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    115-43-308-41-001000

    115-43-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 115
    RFQ
    		115-43-308-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-1-20-003

    210-1-20-003

    CONN IC DIP SOCKET 20POS GOLD

    CNC Tech

    		 690
    RFQ
    		210-1-20-003

    Datasheet

         		- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    115-93-308-41-001000

    115-93-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 214
    RFQ
    		115-93-308-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-318-41-001000

    110-47-318-41-001000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    		 339
    RFQ
    		110-47-318-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-624-41-001000

    110-99-624-41-001000

    CONN IC DIP SOCKET 24POS TINLEAD

    Mill-Max Manufacturing Corp.

    		 365
    RFQ
    		110-99-624-41-001000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-87-210-41-006101

    116-87-210-41-006101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    		 1,275
    RFQ
    		116-87-210-41-006101

    Datasheet

         		116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    111-43-308-41-001000

    111-43-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 445
    RFQ
    		111-43-308-41-001000

    Datasheet

         		111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    69802-044LF

    69802-044LF

    CONN SOCKET PLCC 44POS TIN

    Amphenol ICC (FCI)

    		 4,288
    RFQ
    		69802-044LF

    Datasheet

         		- Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    115-47-316-41-001000

    115-47-316-41-001000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 374
    RFQ
    		115-47-316-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    A-CCS 020-Z-T

    A-CCS 020-Z-T

    IC SOCKET PLCC 20POS TIN

    Assmann WSW Components

    		 558
    RFQ
    		A-CCS 020-Z-T

    Datasheet

         		- Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    110-99-324-41-001000

    110-99-324-41-001000

    CONN IC DIP SOCKET 24POS TINLEAD

    Mill-Max Manufacturing Corp.

    		 445
    RFQ
    		110-99-324-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-318-STT

    ICA-318-STT

    CONN IC DIP SOCKET 18POS TIN

    Samtec Inc.

    		 821
    RFQ
    		ICA-318-STT

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    A-CCS 028-G-T

    A-CCS 028-G-T

    CONN SOCKET PLCC 28POS GOLD

    Assmann WSW Components

    		 5,766
    RFQ
    		A-CCS 028-G-T

    Datasheet

         		- Tube Active PLCC 28 (4 x 7) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    69802-144LF

    69802-144LF

    CONN SOCKET PLCC 44POS TIN

    Amphenol ICC (FCI)

    		 13,720
    RFQ
    		69802-144LF

    Datasheet

         		- Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    16-3518-10T

    16-3518-10T

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 434
    RFQ
    		16-3518-10T

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICA-308-SST

    ICA-308-SST

    CONN IC DIP SOCKET 8POS GOLD

    Samtec Inc.

    		 101
    RFQ
    		ICA-308-SST

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-SGT

    ICO-314-SGT

    CONN IC DIP SKT 14POS

    Samtec Inc.

    		 1,428
    RFQ
    		ICO-314-SGT

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    111-43-314-41-001000

    111-43-314-41-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 6,630
    RFQ
    		111-43-314-41-001000

    Datasheet

         		111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-3518-10

    24-3518-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 274
    RFQ
    		24-3518-10

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AW 127-06/G-T

    AW 127-06/G-T

    SOCKET, MACHINED CONTACTS, 1 ROW

    Assmann WSW Components

    		 867
    RFQ
    		AW 127-06/G-T

    Datasheet

         		- Bag Active - - 0.100" (2.54mm) Gold Flash - Through Hole - Solder - Gold Flash - - -40°C ~ 105°C
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