KATY Electronic Technology Co., LTD - IC Sockets - Sockets for ICs, Transistors - page 23 - Original source of goods - Electronic Components Supplier | IC Distributor

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
A-CCS 084-Z-SM CONN SOCKET PLCC 84POS TIN Assmann WSW Components	392	-	RFQ	Datasheet	-	Tube	Active	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyamide (PA9T), Nylon 9T, Glass Filled	-40°C ~ 105°C
A-CCS 020-G-T CONN SOCKET PLCC 20POS GOLD Assmann WSW Components	265	-	RFQ	Datasheet	-	Tube	Active	PLCC	20 (4 x 5)	0.050" (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
XR2C1011N CONN SOCKET SIP 10POS GOLD Omron Electronics Inc-EMC Div	395	-	RFQ	Datasheet	XR2	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Threaded	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
24-6518-10 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	185	-	RFQ	Datasheet	518	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
D2824-42 CONN IC DIP SOCKET 24POS GOLD Harwin Inc.	2,434	-	RFQ	Datasheet	D2	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
917-47-208-41-005000 CONN SOCKET TRANSIST TO-5 8POS Mill-Max Manufacturing Corp.	174	-	RFQ	Datasheet	917	Tube	Active	Transistor, TO-100	8 (Round)	-	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-47-328-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	168	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICA-314-SST CONN IC DIP SOCKET 14POS GOLD Samtec Inc.	316	-	RFQ	Datasheet	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
8452-21A1-RK-TP CONN SOCKET PLCC 52POS TIN 3M	577	-	RFQ	Datasheet	8400	Tube	Active	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
69802-444LF CONN SOCKET PLCC 44POS TINLEAD Amphenol ICC (FCI)	1,726	-	RFQ	Datasheet	69802	Tape & Reel (TR)	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin-Lead	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Tin-Lead	150.0µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 125°C
ICA-324-STT CONN IC DIP SOCKET 24POS TIN Samtec Inc.	612	-	RFQ	Datasheet	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
210-93-316-41-001000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	354	-	RFQ	Datasheet	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-99-632-41-001000 CONN IC DIP SOCKET 32POS TINLEAD Mill-Max Manufacturing Corp.	186	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-93-314-41-003000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	130	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
917-43-103-41-001000 CONN TRANSIST TO-5 3POS GOLD Mill-Max Manufacturing Corp.	351	-	RFQ	Datasheet	917	Tube	Active	Transistor, TO-5	3 (Round)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
114-87-628-41-117101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	104	-	RFQ	Datasheet	114	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
ICA-308-SGG CONN IC DIP SOCKET 8POS GOLD Samtec Inc.	138	-	RFQ	Datasheet	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
A-CCS 032-G-T CONN SOCKET PLCC 32POS GOLD Assmann WSW Components	918	-	RFQ	Datasheet	-	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
D2822-42 CONN IC DIP SOCKET 22POS GOLD Harwin Inc.	1,057	-	RFQ	Datasheet	D2	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
110-47-632-41-001000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	262	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

Total 19086 Record«Prev 1... 19 20 21 222324 25 26...955 Next»