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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    814-AG10D-ES

    814-AG10D-ES

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    3,954
    RFQ
    814-AG10D-ES

    Datasheet

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - Copper Alloy
    123-83-428-41-001101

    123-83-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,903
    RFQ
    123-83-428-41-001101

    Datasheet

    123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    PLCC-032-T-N-TR

    PLCC-032-T-N-TR

    CONN SOCKET PLCC 32POS TIN

    Samtec Inc.

    2,654
    RFQ
    PLCC-032-T-N-TR

    Datasheet

    PLCC Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) Tin - Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
    116-87-322-41-004101

    116-87-322-41-004101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,560
    RFQ
    116-87-322-41-004101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    116-87-328-41-009101

    116-87-328-41-009101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,840
    RFQ
    116-87-328-41-009101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    110-83-632-41-105191

    110-83-632-41-105191

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,519
    RFQ

    -

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    AR 50-HZL/07-TT

    AR 50-HZL/07-TT

    SOCKET

    Assmann WSW Components

    3,072
    RFQ

    -

    AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
    ICO-318-CTT

    ICO-318-CTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,805
    RFQ
    ICO-318-CTT

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
    916788-1

    916788-1

    CONN SOCKET PGA ZIF 462POS TIN

    TE Connectivity AMP Connectors

    2,809
    RFQ
    916788-1

    Datasheet

    - Tray Obsolete PGA, ZIF (ZIP) 462 (19 x 19) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Liquid Crystal Polymer (LCP) - Phosphor Bronze
    XR2A-1425

    XR2A-1425

    CONN IC DIP SOCKET 14POS GOLD

    Omron Electronics Inc-EMC Div

    3,630
    RFQ
    XR2A-1425

    Datasheet

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Beryllium Copper
    C9118-00

    C9118-00

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,725
    RFQ
    C9118-00

    Datasheet

    Edge-Grip™, C91 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    20-9513-10

    20-9513-10

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,732
    RFQ
    20-9513-10

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    30-6513-10T

    30-6513-10T

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    4,486
    RFQ
    30-6513-10T

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    22-0513-10H

    22-0513-10H

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,232
    RFQ
    22-0513-10H

    Datasheet

    0513 Bulk Active SIP 22 (1 x 22) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    40-1518-10T

    40-1518-10T

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,704
    RFQ
    40-1518-10T

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    ICO-308-SGG-L

    ICO-308-SGG-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,822
    RFQ
    ICO-308-SGG-L

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    ICA-308-SGG-L

    ICA-308-SGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,999
    RFQ
    ICA-308-SGG-L

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    ICA-308-ZWGT-2

    ICA-308-ZWGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,529
    RFQ
    ICA-308-ZWGT-2

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    HLS-0112-T-22

    HLS-0112-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,644
    RFQ
    HLS-0112-T-22

    Datasheet

    HLS Tube Active SIP 12 (1 x 12) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    116-83-424-41-009101

    116-83-424-41-009101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,638
    RFQ
    116-83-424-41-009101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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