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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    14-6513-11

    14-6513-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,256
    RFQ
    14-6513-11

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-0513-11H

    14-0513-11H

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    4,369
    RFQ
    14-0513-11H

    Datasheet

    0513 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-6511-10

    24-6511-10

    CONN IC DIP SOCKET 24POS TIN

    Aries Electronics

    4,074
    RFQ
    24-6511-10

    Datasheet

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-3513-11H

    16-3513-11H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,261
    RFQ
    16-3513-11H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-322-MTT

    ICO-322-MTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,087
    RFQ
    ICO-322-MTT

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    HLS-0114-TT-11

    HLS-0114-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,652
    RFQ
    HLS-0114-TT-11

    Datasheet

    HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    117-83-628-41-105101

    117-83-628-41-105101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,996
    RFQ
    117-83-628-41-105101

    Datasheet

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-420-41-011101

    116-83-420-41-011101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,024
    RFQ
    116-83-420-41-011101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-632-41-001101

    123-87-632-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,132
    RFQ
    123-87-632-41-001101

    Datasheet

    123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4733

    4733

    COVER PWR TRANS .140"ID TO-66

    Keystone Electronics

    4,591
    RFQ
    4733

    Datasheet

    - Bulk Obsolete - - - - - - - - - - - - - - -
    ICF-316-TL-I

    ICF-316-TL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,557
    RFQ
    ICF-316-TL-I

    Datasheet

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICA-316-ZWTT-3

    ICA-316-ZWTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,015
    RFQ
    ICA-316-ZWTT-3

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    115-93-424-41-003000

    115-93-424-41-003000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    2,401
    RFQ
    115-93-424-41-003000

    Datasheet

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-6518-00

    28-6518-00

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,960
    RFQ
    28-6518-00

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    121-83-328-41-001101

    121-83-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,599
    RFQ
    121-83-328-41-001101

    Datasheet

    121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0206-T-2

    HLS-0206-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,114
    RFQ
    HLS-0206-T-2

    Datasheet

    HLS Tube Active SIP 12 (2 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    10-9513-10

    10-9513-10

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,772
    RFQ
    10-9513-10

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-0518-10T

    29-0518-10T

    CONN SOCKET SIP 29POS GOLD

    Aries Electronics

    2,520
    RFQ
    29-0518-10T

    Datasheet

    518 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-0518-10

    32-0518-10

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    2,285
    RFQ
    32-0518-10

    Datasheet

    518 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-1518-10

    32-1518-10

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,866
    RFQ
    32-1518-10

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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