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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    612-83-632-41-001101

    612-83-632-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,378
    RFQ
    612-83-632-41-001101

    Datasheet

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-83-314-10-001101

    299-83-314-10-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,650
    RFQ
    299-83-314-10-001101

    Datasheet

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-632-41-008101

    116-87-632-41-008101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,117
    RFQ
    116-87-632-41-008101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-328-STL-O-TR

    ICF-328-STL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,633
    RFQ
    ICF-328-STL-O-TR

    Datasheet

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    C8124-04

    C8124-04

    CONN IC DIP SOCKET 24POS TIN

    Aries Electronics

    2,816
    RFQ
    C8124-04

    Datasheet

    Edge-Grip™, C81 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-3513-10T

    30-3513-10T

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    4,180
    RFQ
    30-3513-10T

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    117-93-316-41-005000

    117-93-316-41-005000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    4,453
    RFQ
    117-93-316-41-005000

    Datasheet

    117 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-318-ZSST

    ICO-318-ZSST

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,722
    RFQ
    ICO-318-ZSST

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    121-83-428-41-001101

    121-83-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,252
    RFQ
    121-83-428-41-001101

    Datasheet

    121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-628-41-001101

    116-87-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,096
    RFQ
    116-87-628-41-001101

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-428-41-105101

    110-83-428-41-105101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,721
    RFQ
    110-83-428-41-105101

    Datasheet

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-640-41-117101

    114-83-640-41-117101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    2,319
    RFQ
    114-83-640-41-117101

    Datasheet

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-640-41-134161

    114-83-640-41-134161

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,435
    RFQ
    114-83-640-41-134161

    Datasheet

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-624-T-I

    ICF-624-T-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,216
    RFQ
    ICF-624-T-I

    Datasheet

    ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-324-T-O

    ICF-324-T-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,773
    RFQ
    ICF-324-T-O

    Datasheet

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-324-T-I

    ICF-324-T-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,218
    RFQ
    ICF-324-T-I

    Datasheet

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    10-3513-11H

    10-3513-11H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,774
    RFQ
    10-3513-11H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0203-G-38

    HLS-0203-G-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,216
    RFQ
    HLS-0203-G-38

    Datasheet

    HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    510-87-101-15-101101

    510-87-101-15-101101

    CONN SOCKET PGA 101POS GOLD

    Preci-Dip

    4,754
    RFQ
    510-87-101-15-101101

    Datasheet

    510 Bulk Active PGA 101 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0115-TT-10

    HLS-0115-TT-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,122
    RFQ
    HLS-0115-TT-10

    Datasheet

    HLS Tube Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
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