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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    48-6518-10T

    48-6518-10T

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 4,876
    RFQ
    		48-6518-10T

    Datasheet

         		518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-6513-10H

    18-6513-10H

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 4,965
    RFQ
    		18-6513-10H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-9513-11

    20-9513-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 2,286
    RFQ
    		20-9513-11

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-2822-90

    08-2822-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 3,541
    RFQ
    		08-2822-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    08-2823-90

    08-2823-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 2,844
    RFQ
    		08-2823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    08-820-90

    08-820-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 4,598
    RFQ
    		08-820-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    08-822-90

    08-822-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 3,456
    RFQ
    		08-822-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    17-0517-90C

    17-0517-90C

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    		 4,490
    RFQ
    		17-0517-90C

    Datasheet

         		0517 Bulk Active SIP 17 (1 x 17) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-3511-11

    16-3511-11

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 4,026
    RFQ
    		16-3511-11

    Datasheet

         		511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    05-0501-20

    05-0501-20

    CONN SOCKET SIP 5POS TIN

    Aries Electronics

    		 4,003
    RFQ
    		05-0501-20

    Datasheet

         		501 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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