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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    08-8770-310C

    08-8770-310C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,205
    RFQ
    08-8770-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    08-8900-310C

    08-8900-310C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,085
    RFQ
    08-8900-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    08-8937-610C

    08-8937-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,809
    RFQ
    08-8937-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    28-6513-11

    28-6513-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,788
    RFQ
    28-6513-11

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    14-3518-10E

    14-3518-10E

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,514
    RFQ
    14-3518-10E

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    08-6501-21

    08-6501-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,930
    RFQ
    08-6501-21

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    08-6501-31

    08-6501-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,432
    RFQ
    08-6501-31

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    08-0508-21

    08-0508-21

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    4,077
    RFQ
    08-0508-21

    Datasheet

    508 Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    08-0508-31

    08-0508-31

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    2,084
    RFQ
    08-0508-31

    Datasheet

    508 Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    08-1508-21

    08-1508-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,193
    RFQ
    08-1508-21

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
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