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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    05-0501-30

    05-0501-30

    CONN SOCKET SIP 5POS TIN

    Aries Electronics

    2,936
    RFQ
    05-0501-30

    Datasheet

    501 Bulk Active SIP 5 (1 x 5) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    10-6820-90TWR

    10-6820-90TWR

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    3,671
    RFQ
    10-6820-90TWR

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    10-6822-90TWR

    10-6822-90TWR

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    4,548
    RFQ
    10-6822-90TWR

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    30-0518-00

    30-0518-00

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    3,982
    RFQ
    30-0518-00

    Datasheet

    518 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    30-1518-00

    30-1518-00

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,309
    RFQ
    30-1518-00

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    08-81250-610C

    08-81250-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,599
    RFQ
    08-81250-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    08-8305-610C

    08-8305-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,069
    RFQ
    08-8305-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    28-6518-10M

    28-6518-10M

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,307
    RFQ
    28-6518-10M

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    08-71000-10

    08-71000-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    4,184
    RFQ
    08-71000-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-71250-10

    08-71250-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    3,001
    RFQ
    08-71250-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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