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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    03-7880-10

    03-7880-10

    CONN SOCKET SIP 3POS TIN

    Aries Electronics

    4,908
    RFQ
    03-7880-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-0503-21

    10-0503-21

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    4,858
    RFQ
    10-0503-21

    Datasheet

    0503 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    10-0503-31

    10-0503-31

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    4,565
    RFQ
    10-0503-31

    Datasheet

    0503 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    31-0518-11H

    31-0518-11H

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    4,428
    RFQ
    31-0518-11H

    Datasheet

    518 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    31-0511-10

    31-0511-10

    CONN SOCKET SIP 31POS TIN

    Aries Electronics

    3,011
    RFQ
    31-0511-10

    Datasheet

    511 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-0508-20

    19-0508-20

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    2,916
    RFQ
    19-0508-20

    Datasheet

    508 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    19-0508-30

    19-0508-30

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    4,285
    RFQ
    19-0508-30

    Datasheet

    508 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    24-1518-11H

    24-1518-11H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,457
    RFQ
    24-1518-11H

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-C212-11

    24-C212-11

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,667
    RFQ
    24-C212-11

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-6518-101

    32-6518-101

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,448
    RFQ
    32-6518-101

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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