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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    12-6822-90C

    12-6822-90C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,802
    RFQ
    12-6822-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    12-6823-90C

    12-6823-90C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,444
    RFQ
    12-6823-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    10-0508-21

    10-0508-21

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    2,551
    RFQ
    10-0508-21

    Datasheet

    508 Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    10-0508-31

    10-0508-31

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    3,317
    RFQ
    10-0508-31

    Datasheet

    508 Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    10-1508-21

    10-1508-21

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,934
    RFQ
    10-1508-21

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    10-1508-31

    10-1508-31

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,715
    RFQ
    10-1508-31

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    40-3513-10

    40-3513-10

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,120
    RFQ
    40-3513-10

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    50-9513-10

    50-9513-10

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    4,417
    RFQ
    50-9513-10

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    21-0517-90C

    21-0517-90C

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    4,320
    RFQ
    21-0517-90C

    Datasheet

    0517 Bulk Active SIP 21 (1 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    28-6513-10H

    28-6513-10H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,349
    RFQ
    28-6513-10H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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