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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    14-4820-90C

    14-4820-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,609
    RFQ
    		14-4820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-4823-90C

    14-4823-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,155
    RFQ
    		14-4823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6820-90C

    14-6820-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,948
    RFQ
    		14-6820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6822-90C

    14-6822-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,274
    RFQ
    		14-6822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6823-90C

    14-6823-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,526
    RFQ
    		14-6823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-820-90C

    14-820-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,810
    RFQ
    		14-820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-822-90C

    14-822-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 2,467
    RFQ
    		14-822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-1518-11H

    32-1518-11H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 3,145
    RFQ
    		32-1518-11H

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-0503-20

    16-0503-20

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    		 2,304
    RFQ
    		16-0503-20

    Datasheet

         		0503 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    16-0503-30

    16-0503-30

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    		 3,848
    RFQ
    		16-0503-30

    Datasheet

         		0503 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
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