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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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84-537-21-7CONN SOCKET PLCC ZIF 84POS GOLD Aries Electronics |
4,731 |
|
Datasheet |
537 | - | Active | PLCC, ZIF (ZIP) | 84 (4 x 21) | Gold | 12.0µin (0.30µm) | - | - | Closed Frame | 0.100" (2.54mm) | - | - | - | - | - | - | - |
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209-PGM17030-11CONN SOCKET PGA GOLD Aries Electronics |
2,128 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
209-PGM17046-11CONN SOCKET PGA GOLD Aries Electronics |
3,452 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
34-6511-10CONN IC DIP SOCKET 34POS TIN Aries Electronics |
4,192 |
|
Datasheet |
511 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 34 (2 x 17) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
34-6511-11CONN IC DIP SOCKET 34POS GOLD Aries Electronics |
3,493 |
|
Datasheet |
511 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 34 (2 x 17) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
|
|
02-0501-30CONN SOCKET SIP 2POS TIN Aries Electronics |
2,892 |
|
Datasheet |
501 | Bulk | Active | SIP | 2 (1 x 2) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
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03-0501-21CONN SOCKET SIP 3POS GOLD Aries Electronics |
4,982 |
|
Datasheet |
501 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
|
|
07-7XXXX-10CONN SOCKET SIP 7POS TIN Aries Electronics |
2,228 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 7 (1 x 7) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
12-7XXXX-10CONN SOCKET SIP 12POS TIN Aries Electronics |
3,200 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 12 (1 x 12) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
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20-7XXXX-10CONN SOCKET SIP 20POS TIN Aries Electronics |
4,316 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 20 (1 x 20) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
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