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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    1109800-28

    1109800-28

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,732
    RFQ
    		1109800-28

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    1109800-10

    1109800-10

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,898
    RFQ
    		1109800-10

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    1109800-12

    1109800-12

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    		 3,291
    RFQ
    		1109800-12

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    1109800-22

    1109800-22

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 2,764
    RFQ
    		1109800-22

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    1109800-24

    1109800-24

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,947
    RFQ
    		1109800-24

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    1109800-26

    1109800-26

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 2,440
    RFQ
    		1109800-26

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    1109800-8

    1109800-8

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 4,361
    RFQ
    		1109800-8

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    1109681-308

    1109681-308

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 3,484
    RFQ
    		1109681-308

    Datasheet

         		- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Brass Through Hole Spacer 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    1109681-316

    1109681-316

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 2,336
    RFQ
    		1109681-316

    Datasheet

         		- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Brass Through Hole Spacer 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    1109681-632

    1109681-632

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,231
    RFQ
    		1109681-632

    Datasheet

         		- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Brass Through Hole Spacer 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    Total 4131 Record«Prev1... 409410411412413414Next»
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