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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    18-68500-10

    18-68500-10

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    4,627
    RFQ
    18-68500-10

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-8620-210C

    08-8620-210C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,904
    RFQ
    08-8620-210C

    Datasheet

    8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8300-210C

    10-8300-210C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,638
    RFQ
    10-8300-210C

    Datasheet

    8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8535-210C

    10-8535-210C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,482
    RFQ
    10-8535-210C

    Datasheet

    8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8810-210C

    10-8810-210C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,497
    RFQ
    10-8810-210C

    Datasheet

    8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    14-8500-611C

    14-8500-611C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,037
    RFQ
    14-8500-611C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    1108883-05

    1108883-05

    SERIES 0517 PIN-LINE VERTISOCKET

    Aries Electronics

    2,695
    RFQ
    1108883-05

    Datasheet

    - - Active - - - - - - - - - - - - - - -
    1109800-14

    1109800-14

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,364
    RFQ
    1109800-14

    Datasheet

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    1109800-16

    1109800-16

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,737
    RFQ
    1109800-16

    Datasheet

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    1109800-20

    1109800-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,588
    RFQ
    1109800-20

    Datasheet

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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