| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
18-68500-10CONN IC DIP SOCKET 18POS TIN Aries Electronics |
4,627 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
08-8620-210CCONN IC DIP SOCKET 8POS GOLD Aries Electronics |
4,904 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
10-8300-210CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
2,638 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
10-8535-210CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
2,482 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
10-8810-210CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
2,497 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
14-8500-611CCONN IC DIP SOCKET 14POS GOLD Aries Electronics |
3,037 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
1108883-05SERIES 0517 PIN-LINE VERTISOCKET Aries Electronics |
2,695 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
1109800-14CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
2,364 |
|
Datasheet |
Correct-A-Chip® 1109800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin-Lead | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
1109800-16CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
4,737 |
|
Datasheet |
Correct-A-Chip® 1109800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin-Lead | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
1109800-20CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
2,588 |
|
Datasheet |
Correct-A-Chip® 1109800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin-Lead | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |