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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XR2C-0311-NCONN SOCKET SIP 3POS GOLD Omron Electronics Inc-EMC Div |
3,654 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
XR2A-0811-NCONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div |
331 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
XR2A-1401-NCONN IC DIP SOCKET 14POS GOLD Omron Electronics Inc-EMC Div |
251 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 29.5µin (0.75µm) | Beryllium Copper |
|
XR2C-2011-NCONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
142 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 20 (1 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
XR2C1011NCONN SOCKET SIP 10POS GOLD Omron Electronics Inc-EMC Div |
395 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 10 (1 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
XR2A-0825CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div |
120 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | Flash | Beryllium Copper |
|
|
XR2A-1801-NCONN IC DIP SOCKET 18POS GOLD Omron Electronics Inc-EMC Div |
151 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
XR2A-0815CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div |
118 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Brass |
|
XR2P1041CONN SOCKET SIP 10POS GOLD Omron Electronics Inc-EMC Div |
795 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 10 (1 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Brass |
|
XR2A-1611-NCONN IC DIP SOCKET 16POS GOLD Omron Electronics Inc-EMC Div |
49 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
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