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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    XR2A-2811-N

    XR2A-2811-N

    CONN IC DIP SOCKET 28POS GOLD

    Omron Electronics Inc-EMC Div

    3,490
    RFQ
    XR2A-2811-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    XR2A-2471-N

    XR2A-2471-N

    IC CONNECTOR

    Omron Electronics Inc-EMC Div

    2,608
    RFQ

    -

    * Bulk Active - - - - - - - - - - - - - - -
    XR2A-2401-N

    XR2A-2401-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    3,420
    RFQ
    XR2A-2401-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 30.0µin (0.76µm) Beryllium Copper
    XR2A-3211-N

    XR2A-3211-N

    CONN IC DIP SOCKET 32POS GOLD

    Omron Electronics Inc-EMC Div

    3,992
    RFQ
    XR2A-3211-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    XR2A-2025

    XR2A-2025

    CONN IC DIP SOCKET 20POS GOLD

    Omron Electronics Inc-EMC Div

    2,845
    RFQ
    XR2A-2025

    Datasheet

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Beryllium Copper
    XR2A-2801-N

    XR2A-2801-N

    CONN IC DIP SOCKET 28POS GOLD

    Omron Electronics Inc-EMC Div

    3,532
    RFQ
    XR2A-2801-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 30.0µin (0.76µm) Beryllium Copper
    XR2A-3221-N

    XR2A-3221-N

    CONN IC DIP SOCKET 32POS GOLD

    Omron Electronics Inc-EMC Div

    3,475
    RFQ
    XR2A-3221-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Brass
    XR2C-3215

    XR2C-3215

    CONN SOCKET SIP 32POS GOLD

    Omron Electronics Inc-EMC Div

    2,963
    RFQ
    XR2C-3215

    Datasheet

    XR2 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Brass
    XR2T-2401-N

    XR2T-2401-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    4,182
    RFQ
    XR2T-2401-N

    Datasheet

    XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Threaded Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 29.5µin (0.75µm) Brass
    XR2T-2411-N

    XR2T-2411-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    3,834
    RFQ
    XR2T-2411-N

    Datasheet

    XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Threaded Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Brass
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