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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    XR2A-2411-N

    XR2A-2411-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    97
    RFQ
    XR2A-2411-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2P2041

    XR2P2041

    CONN SOCKET SIP 20POS GOLD

    Omron Electronics Inc-EMC Div

    96
    RFQ
    XR2P2041

    Datasheet

    XR2 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-3201-N

    XR2A-3201-N

    CONN IC DIP SOCKET 32POS GOLD

    Omron Electronics Inc-EMC Div

    55
    RFQ
    XR2A-3201-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2C-3205

    XR2C-3205

    CONN SOCKET SIP 32POS GOLD

    Omron Electronics Inc-EMC Div

    95
    RFQ
    XR2C-3205

    Datasheet

    XR2 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2C-2015

    XR2C-2015

    CONN SOCKET SIP 20POS GOLD

    Omron Electronics Inc-EMC Div

    43
    RFQ
    XR2C-2015

    Datasheet

    XR2 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2T-2021-N

    XR2T-2021-N

    CONN IC DIP SOCKET 20POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2T-2021-N

    Datasheet

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-1625

    XR2A-1625

    CONN IC DIP SOCKET 16POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2A-1625

    Datasheet

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-0802

    XR2A-0802

    CONN IC DIP SOCKET 8POS GOLD

    Omron Electronics Inc-EMC Div

    54
    RFQ
    XR2A-0802

    Datasheet

    XR2 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR3G-6401

    XR3G-6401

    CONN IC SOCKET 64POS

    Omron Electronics Inc-EMC Div

    7
    RFQ
    XR3G-6401

    Datasheet

    - Box Active - - - - - - - - - - - - - - -
    XR2A-1411-N

    XR2A-1411-N

    CONN IC DIP SOCKET 14POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2A-1411-N

    Datasheet

    XR2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
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