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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR 10-HZW/TNCONN IC DIP SOCKET 4POS TIN Assmann WSW Components |
4,197 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
|
AR 50-HZL-TTSOCKET Assmann WSW Components |
4,317 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
A-CCS 032-Z-SM/TIC SOCKET, CHIP CARRIER, 1.27MM, Assmann WSW Components |
4,239 |
|
Datasheet |
- | Tape & Reel (TR) | Active | PLCC | 32 | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 160.0µin (4.06µm) | Phosphor Bronze |
|
|
AR 36-HGL-TTSOCKET Assmann WSW Components |
4,754 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | Flash | Brass |
|
|
AR 52-HZL-TTSOCKET Assmann WSW Components |
3,152 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Brass |
|
A40-LCGCONN IC DIP SOCKET 40POS GOLD Assmann WSW Components |
2,751 |
|
- |
- | - | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | - | - | Through Hole | Open Frame | 0.100" (2.54mm) | - | 0.100" (2.54mm) | - | Gold | - | - | - |
|
|
AW 127-39/Z-TSOCKET 39 CONTACTS SINGLE ROW Assmann WSW Components |
2,514 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
AR 18-HZL/01-TTCONN IC DIP SOCKET 18POS GOLD Assmann WSW Components |
2,837 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
A20-LCG-T-RCONN IC DIP SOCKET 20POS GOLD Assmann WSW Components |
3,871 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | - | - | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | - | - |
|
A-CCS32-Z-RCONN SOCKET PLCC 32POS TIN Assmann WSW Components |
3,814 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 150.0µin (3.81µm) | Phosphor Bronze |
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