Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    AR 10-HZW/TN

    AR 10-HZW/TN

    CONN IC DIP SOCKET 4POS TIN

    Assmann WSW Components

    4,197
    RFQ
    AR 10-HZW/TN

    Datasheet

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 50-HZL-TT

    AR 50-HZL-TT

    SOCKET

    Assmann WSW Components

    4,317
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A-CCS 032-Z-SM/T

    A-CCS 032-Z-SM/T

    IC SOCKET, CHIP CARRIER, 1.27MM,

    Assmann WSW Components

    4,239
    RFQ
    A-CCS 032-Z-SM/T

    Datasheet

    - Tape & Reel (TR) Active PLCC 32 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    AR 36-HGL-TT

    AR 36-HGL-TT

    SOCKET

    Assmann WSW Components

    4,754
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 52-HZL-TT

    AR 52-HZL-TT

    SOCKET

    Assmann WSW Components

    3,152
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A40-LCG

    A40-LCG

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    2,751
    RFQ

    -

    - - Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
    AW 127-39/Z-T

    AW 127-39/Z-T

    SOCKET 39 CONTACTS SINGLE ROW

    Assmann WSW Components

    2,514
    RFQ
    AW 127-39/Z-T

    Datasheet

    - - Active - - - - - - - - - - - - - - -
    AR 18-HZL/01-TT

    AR 18-HZL/01-TT

    CONN IC DIP SOCKET 18POS GOLD

    Assmann WSW Components

    2,837
    RFQ
    AR 18-HZL/01-TT

    Datasheet

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A20-LCG-T-R

    A20-LCG-T-R

    CONN IC DIP SOCKET 20POS GOLD

    Assmann WSW Components

    3,871
    RFQ
    A20-LCG-T-R

    Datasheet

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    A-CCS32-Z-R

    A-CCS32-Z-R

    CONN SOCKET PLCC 32POS TIN

    Assmann WSW Components

    3,814
    RFQ
    A-CCS32-Z-R

    Datasheet

    - Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    Total 326 Record«Prev1... 1718192021222324...33Next»
    Your email
    Your message
    KATY Electronic Technology Co., LTD

    HOME

    KATY Electronic Technology Co., LTD

    PRODUCT

    KATY Electronic Technology Co., LTD

    PHONE

    KATY Electronic Technology Co., LTD

    USER