KATY Electronic Technology Co., LTD - IC Sockets - Sockets for ICs, Transistors - page 24 - Original source of goods - Electronic Components Supplier | IC Distributor

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
A-CCS 052-Z-SM CONN SOCKET PLCC 52POS TIN Assmann WSW Components	2,552	-	RFQ	Datasheet	-	Tube	Active	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyamide (PA9T), Nylon 9T, Glass Filled	-40°C ~ 105°C
A-CCS52-Z-R CONN SOCKET PLCC 52POS TIN Assmann WSW Components	4,625	-	RFQ	Datasheet	-	Tube	Obsolete	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
AR40-HZL/01-TT CONN IC DIP SOCKET 40POS GOLD Assmann WSW Components	2,904	-	RFQ	Datasheet	-	Bag	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
AR24-HZL/01-TT CONN IC DIP SOCKET 24POS GOLD Assmann WSW Components	2,684	-	RFQ	Datasheet	-	Bag	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
AR 28 HGL-TT SOCKET Assmann WSW Components	2,518	-	RFQ	-	AR	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
AR 28 HGL/7-TT SOCKET Assmann WSW Components	3,936	-	RFQ	-	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
A-CCS44-G CONN SOCKET PLCC 44POS GOLD Assmann WSW Components	4,123	-	RFQ	Datasheet	-	Bag	Obsolete	PLCC	44 (4 x 11)	0.050" (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
A-CCS 068-Z-SM IC SOCKET PLCC 68POS TIN SMD Assmann WSW Components	4,665	-	RFQ	Datasheet	-	Tube	Active	PLCC	68 (4 x 17)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyamide (PA9T), Nylon 9T, Glass Filled	-40°C ~ 105°C
A-CCS84-Z-SM-R CONN SOCKET PLCC 84POS TIN Assmann WSW Components	3,530	-	RFQ	Datasheet	-	Tube	Obsolete	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
AR40-HZL-TT CONN IC DIP SOCKET 40POS TIN Assmann WSW Components	4,186	-	RFQ	Datasheet	-	Bag	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C

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