KATY Electronic Technology Co., LTD - IC Sockets - Sockets for ICs, Transistors - page 23 - Original source of goods - Electronic Components Supplier | IC Distributor

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
AR24-HZL/7/01-TT CONN IC DIP SOCKET 24POS GOLD Assmann WSW Components	3,577	-	RFQ	-	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
AR 42-HGL-TT SOCKET Assmann WSW Components	3,247	-	RFQ	-	AR	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
AR28-HZL/7/01-TT CONN IC DIP SOCKET 28POS GOLD Assmann WSW Components	2,104	-	RFQ	-	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
A-CCS084-Z-SM/P SOCKET Assmann WSW Components	2,378	-	RFQ	-	-	Bulk	Active	PLCC	84	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-40°C ~ 105°C
A-ICS-254-06-TT50 IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components	3,196	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6	0.100" (2.54mm)	Nickel	78.7µin (2.00µm)	Beryllium Copper	Through Hole, Right Angle	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
A-CCS 020-Z-SM/T IC SOCKET, CHIP CARRIER, 1.27MM, Assmann WSW Components	2,641	-	RFQ	Datasheet	-	Tape & Reel (TR)	Active	PLCC	20	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-40°C ~ 105°C
A24-LCG-T-R CONN IC DIP SOCKET 24POS GOLD Assmann WSW Components	3,131	-	RFQ	Datasheet	-	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
AR16-HZW/T CONN IC DIP SOCKET 16POS GOLD Assmann WSW Components	4,745	-	RFQ	Datasheet	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
A-CCS044-Z-SM/T SOCKET Assmann WSW Components	4,807	-	RFQ	Datasheet	-	Bulk	Active	PLCC	44	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	-	-	-	Polyphenylene Sulfide (PPS), Glass Filled	-40°C ~ 105°C
AR20-HZL/07-TT CONN IC DIP SOCKET 20POS GOLD Assmann WSW Components	4,300	-	RFQ	Datasheet	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C

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