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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR24-HZL/7/01-TTCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
3,577 |
|
- |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
AR 42-HGL-TTSOCKET Assmann WSW Components |
3,247 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | Flash | Brass |
|
|
AR28-HZL/7/01-TTCONN IC DIP SOCKET 28POS GOLD Assmann WSW Components |
2,104 |
|
- |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
|
A-CCS084-Z-SM/PSOCKET Assmann WSW Components |
2,378 |
|
- |
- | Bulk | Active | PLCC | 84 | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 160.0µin (4.06µm) | Phosphor Bronze |
|
|
A-ICS-254-06-TT50IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components |
3,196 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 | Nickel | 78.7µin (2.00µm) | Beryllium Copper | Through Hole, Right Angle | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 78.7µin (2.00µm) | Brass |
|
|
A-CCS 020-Z-SM/TIC SOCKET, CHIP CARRIER, 1.27MM, Assmann WSW Components |
2,641 |
|
Datasheet |
- | Tape & Reel (TR) | Active | PLCC | 20 | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 160.0µin (4.06µm) | Phosphor Bronze |
|
A24-LCG-T-RCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
3,131 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | - | - | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | - | - |
|
AR16-HZW/TCONN IC DIP SOCKET 16POS GOLD Assmann WSW Components |
4,745 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
|
A-CCS044-Z-SM/TSOCKET Assmann WSW Components |
4,807 |
|
Datasheet |
- | Bulk | Active | PLCC | 44 | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -40°C ~ 105°C | - | Polyphenylene Sulfide (PPS), Glass Filled | - | - |
|
AR20-HZL/07-TTCONN IC DIP SOCKET 20POS GOLD Assmann WSW Components |
4,300 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
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