| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A-ICS-254-14-TT50IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components |
2,631 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | Nickel | 78.7µin (2.00µm) | Beryllium Copper | Through Hole, Right Angle | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 78.7µin (2.00µm) | Brass |
|
AR 50-HZL/01-TTSOCKET Assmann WSW Components |
3,154 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Brass |
|
AR48-HZL/01-TTCONN IC DIP SOCKET 48POS GOLD Assmann WSW Components |
3,069 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
AR 32-HZL/07-TTCONN IC DIP SOCKET 32POS GOLD Assmann WSW Components |
3,698 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
AW-127A-20-ZCONN SOCKET SIP 20POS TIN Assmann WSW Components |
2,709 |
|
Datasheet |
- | - | Obsolete | SIP | 20 (1 x 20) | Tin | 78.7µin (2.00µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | - | - | - | - | - | - | - |
|
AR 52-HZL/01-TTSOCKET Assmann WSW Components |
4,598 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Brass |
|
AR 64-HZL-TTCONN IC DIP SOCKET 64POS TIN Assmann WSW Components |
2,630 |
|
Datasheet |
- | Tray | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
AR 24-HZL/07/7-TTCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
2,831 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
A-CCS84-GCONN SOCKET PLCC 84POS GOLD Assmann WSW Components |
2,261 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 84 (4 x 21) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
|
AR40-HZW/TCONN IC DIP SOCKET 40POS GOLD Assmann WSW Components |
2,880 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |