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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    A-ICS-254-16-TT50

    A-ICS-254-16-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    2,831
    RFQ
    A-ICS-254-16-TT50

    Datasheet

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 78.7µin (2.00µm) Brass
    AR40-HZL/07-TT

    AR40-HZL/07-TT

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    4,905
    RFQ
    AR40-HZL/07-TT

    Datasheet

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
    AJ 64-HZL-T

    AJ 64-HZL-T

    SOCKET

    Assmann WSW Components

    2,589
    RFQ

    -

    - Bulk Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) 196.9µin (5.00µm) Brass
    AR 22-HZL/07/7-TT

    AR 22-HZL/07/7-TT

    SOCKET

    Assmann WSW Components

    4,859
    RFQ

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Brass Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Brass
    AR 28-HZL/07/7-TT

    AR 28-HZL/07/7-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    4,760
    RFQ
    AR 28-HZL/07/7-TT

    Datasheet

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
    AR 48 HZL/07-TT

    AR 48 HZL/07-TT

    CONN IC DIP SOCKET 48POS GOLD

    Assmann WSW Components

    2,451
    RFQ
    AR 48 HZL/07-TT

    Datasheet

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
    A-ICS-254-18-TT50

    A-ICS-254-18-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    4,561
    RFQ
    A-ICS-254-18-TT50

    Datasheet

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 78.7µin (2.00µm) Brass
    AR 36-HZL/07-TT

    AR 36-HZL/07-TT

    SOCKET

    Assmann WSW Components

    2,925
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
    AR 40-HZL/07-TT

    AR 40-HZL/07-TT

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    2,509
    RFQ
    AR 40-HZL/07-TT

    Datasheet

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
    AR 64-HZL/01-TT

    AR 64-HZL/01-TT

    SOCKET

    Assmann WSW Components

    4,370
    RFQ

    -

    AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
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