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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR 28-HZL/01-7-TTSOCKET Assmann WSW Components |
2,096 |
|
- |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
A-ICS-254-20-TT50IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components |
2,795 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 | Nickel | 78.7µin (2.00µm) | Beryllium Copper | Through Hole, Right Angle | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 78.7µin (2.00µm) | Brass |
|
|
AR 42-HZL/07-TTSOCKET Assmann WSW Components |
4,813 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
AR 24-HZW/TNCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
4,052 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
|
AR 48-HZL/07-TTCONN IC DIP SOCKET 48POS GOLD Assmann WSW Components |
4,007 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
|
A-ICS-254-24-TT50IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components |
3,222 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 | Nickel | 78.7µin (2.00µm) | Beryllium Copper | Through Hole, Right Angle | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 78.7µin (2.00µm) | Brass |
|
|
AR 50-HZL/07-TTSOCKET Assmann WSW Components |
3,072 |
|
- |
AR | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
AR 52-HZL/07-TTSOCKET Assmann WSW Components |
4,729 |
|
- |
AR | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
A-ICS-254-28-TT50IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components |
2,982 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 | Nickel | 78.7µin (2.00µm) | Beryllium Copper | Through Hole, Right Angle | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 78.7µin (2.00µm) | Brass |
|
|
AR32-HZW/T-RCONN IC DIP SOCKET 32POS TIN Assmann WSW Components |
2,030 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester, Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
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