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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    PGA175H010B5-1620R

    PGA175H010B5-1620R

    PGA SOCKET 175 CTS

    Amphenol ICC (FCI)

    2,455
    RFQ
    PGA175H010B5-1620R

    Datasheet

    - - Active PGA 175 (16 x 16) Gold 30.0µin (0.76µm) - Through Hole Open Frame 0.100" (2.54mm) - - - - - - -
    APO-318-T-T

    APO-318-T-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,815
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    20-8865-310C

    20-8865-310C

    CONN ELEVATOR SOCKET 20 PO .300

    Aries Electronics

    2,707
    RFQ

    -

    8 - Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    299-83-632-10-002101

    299-83-632-10-002101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,092
    RFQ
    299-83-632-10-002101

    Datasheet

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    28-3518-10E

    28-3518-10E

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,340
    RFQ
    28-3518-10E

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    18-6820-90

    18-6820-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,425
    RFQ
    18-6820-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    ICO-632-NGT

    ICO-632-NGT

    CONN IC DIP SOCKET 32POS GOLD

    Samtec Inc.

    2,105
    RFQ
    ICO-632-NGT

    Datasheet

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    346-93-139-41-013000

    346-93-139-41-013000

    CONN SOCKET SIP 39POS GOLD

    Mill-Max Manufacturing Corp.

    4,251
    RFQ
    346-93-139-41-013000

    Datasheet

    346 Bulk Active SIP 39 (1 x 39) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    346-43-139-41-013000

    346-43-139-41-013000

    CONN SOCKET SIP 39POS GOLD

    Mill-Max Manufacturing Corp.

    3,939
    RFQ
    346-43-139-41-013000

    Datasheet

    346 Bulk Active SIP 39 (1 x 39) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    24-0503-30

    24-0503-30

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    4,942
    RFQ
    24-0503-30

    Datasheet

    0503 Bulk Active SIP 24 (1 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
    20-3508-302

    20-3508-302

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,893
    RFQ
    20-3508-302

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    14-3508-202

    14-3508-202

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,636
    RFQ
    14-3508-202

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    14-3508-302

    14-3508-302

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,501
    RFQ
    14-3508-302

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    APO-318-G-A

    APO-318-G-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,599
    RFQ
    APO-318-G-A

    Datasheet

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    ICO-324-MGG

    ICO-324-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,490
    RFQ
    ICO-324-MGG

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    299-93-624-10-002000

    299-93-624-10-002000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    3,651
    RFQ
    299-93-624-10-002000

    Datasheet

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    299-43-624-10-002000

    299-43-624-10-002000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    2,786
    RFQ
    299-43-624-10-002000

    Datasheet

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    HLS-0311-T-11

    HLS-0311-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,980
    RFQ
    HLS-0311-T-11

    Datasheet

    HLS Tube Active SIP 33 (3 x 11) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    32-6501-20

    32-6501-20

    CONN IC DIP SOCKET 32POS TIN

    Aries Electronics

    3,538
    RFQ
    32-6501-20

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    32-6501-30

    32-6501-30

    CONN IC DIP SOCKET 32POS TIN

    Aries Electronics

    3,754
    RFQ
    32-6501-30

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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