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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    18-3501-21

    18-3501-21

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 3,152
    RFQ
    		18-3501-21

    Datasheet

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    110-93-304-61-001000

    110-93-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,501
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    23-0508-30

    23-0508-30

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    		 4,051
    RFQ
    		23-0508-30

    Datasheet

         		508 Bulk Active SIP 23 (1 x 23) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    210-44-306-41-001000

    210-44-306-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 4,748
    RFQ
    		210-44-306-41-001000

    Datasheet

         		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    210-99-306-41-001000

    210-99-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,587
    RFQ
    		210-99-306-41-001000

    Datasheet

         		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    510-83-168-17-001101

    510-83-168-17-001101

    CONN SOCKET PGA 168POS GOLD

    Preci-Dip

    		 4,691
    RFQ
    		510-83-168-17-001101

    Datasheet

         		510 Bulk Active PGA 168 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    15-7350-10

    15-7350-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 4,692
    RFQ
    		15-7350-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    15-7450-10

    15-7450-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 4,388
    RFQ
    		15-7450-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    15-7500-10

    15-7500-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 2,865
    RFQ
    		15-7500-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    15-7540-10

    15-7540-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 2,160
    RFQ
    		15-7540-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    15-7635-10

    15-7635-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 3,208
    RFQ
    		15-7635-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    15-7695-10

    15-7695-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 4,558
    RFQ
    		15-7695-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    15-7850-10

    15-7850-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 2,164
    RFQ
    		15-7850-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    10-6810-90TWR

    10-6810-90TWR

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    		 4,148
    RFQ
    		10-6810-90TWR

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    ICA-628-WGT-2

    ICA-628-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 3,248
    RFQ
    		ICA-628-WGT-2

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    24-6820-90C

    24-6820-90C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,798
    RFQ
    		24-6820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    24-6823-90C

    24-6823-90C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,241
    RFQ
    		24-6823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    APH-0906-G-R

    APH-0906-G-R

    APH-0906-G-R

    Samtec Inc.

    		 2,815
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1906-G-R

    APH-1906-G-R

    APH-1906-G-R

    Samtec Inc.

    		 2,351
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1006-G-R

    APH-1006-G-R

    APH-1006-G-R

    Samtec Inc.

    		 4,312
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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