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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APH-0606-G-R

    APH-0606-G-R

    APH-0606-G-R

    Samtec Inc.

    3,503
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1106-G-R

    APH-1106-G-R

    APH-1106-G-R

    Samtec Inc.

    2,580
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1606-G-R

    APH-1606-G-R

    APH-1606-G-R

    Samtec Inc.

    3,392
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1306-G-R

    APH-1306-G-R

    APH-1306-G-R

    Samtec Inc.

    4,222
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0806-G-R

    APH-0806-G-R

    APH-0806-G-R

    Samtec Inc.

    2,930
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1206-G-R

    APH-1206-G-R

    APH-1206-G-R

    Samtec Inc.

    2,986
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0706-G-R

    APH-0706-G-R

    APH-0706-G-R

    Samtec Inc.

    4,141
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    HLS-0307-G-12

    HLS-0307-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,744
    RFQ
    HLS-0307-G-12

    Datasheet

    HLS Tube Active SIP 21 (3 x 7) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
    1735315-4

    1735315-4

    CONN SOCKET PGA ZIF 939POS GOLD

    TE Connectivity AMP Connectors

    4,299
    RFQ

    -

    - Tray Obsolete PGA, ZIF (ZIP) 939 (31 x 31) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Gold Thermoplastic 15.0µin (0.38µm) Copper Alloy
    13-0501-20

    13-0501-20

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    2,263
    RFQ
    13-0501-20

    Datasheet

    501 Bulk Active SIP 13 (1 x 13) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    13-0501-30

    13-0501-30

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    2,420
    RFQ
    13-0501-30

    Datasheet

    501 Bulk Active SIP 13 (1 x 13) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    40-3513-10H

    40-3513-10H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,310
    RFQ
    40-3513-10H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    ICA-632-ZWGT-3

    ICA-632-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,288
    RFQ
    ICA-632-ZWGT-3

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    HLS-0120-G-38

    HLS-0120-G-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,512
    RFQ
    HLS-0120-G-38

    Datasheet

    HLS Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
    210-47-306-41-001000

    210-47-306-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,693
    RFQ
    210-47-306-41-001000

    Datasheet

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    117-43-448-41-005000

    117-43-448-41-005000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    6
    RFQ
    117-43-448-41-005000

    Datasheet

    117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    14-0501-21

    14-0501-21

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    3,933
    RFQ
    14-0501-21

    Datasheet

    501 Bulk Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    24-4518-01

    24-4518-01

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,582
    RFQ
    24-4518-01

    Datasheet

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    20-6820-90C

    20-6820-90C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,112
    RFQ
    20-6820-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    20-6822-90C

    20-6822-90C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,812
    RFQ
    20-6822-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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