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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
48-6554-11CONN IC DIP SOCKET ZIF 48POS GLD |
97 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyphenylene Sulfide (PPS), Glass Filled | - | Beryllium Copper |
|
220-2600-00-0602CONN SOCKET SIP ZIF 20POS GOLD |
4 |
|
Datasheet |
Textool™ | Bulk | Active | SIP, ZIF (ZIP) | 20 (1 x 20) | Gold | - | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
236-6225-00-0602CONN SOCKET SIP ZIF 36POS GOLD |
6 |
|
Datasheet |
Textool™ | Bulk | Active | SIP, ZIF (ZIP) | 36 (1 x 36) | Gold | - | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
248-5205-01CONN SOCKET QFN 48POS GOLD |
4 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 48 (4 x 12) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.020" (0.50mm) | Solder | - | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
|
264-5205-01CONN SOCKET QFN 64POS GOLD |
21 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 64 (4 x 16) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.020" (0.50mm) | Solder | 0.020" (0.50mm) | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
441-PRS21001-12CONN SOCKET PGA ZIF GOLD |
19 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
288-4205-01CONN SOCKET QFN 88POS GOLD |
11 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 88 (4 x 22) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.016" (0.40mm) | Solder | 0.016" (0.40mm) | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
ICS-624-TIC SOCKET, DIP, 24P 2.54MM PITCH |
791 |
|
Datasheet |
ICS | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
|
ED06DTCONN IC DIP SOCKET 6POS TIN |
470 |
|
Datasheet |
ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 110°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 60.0µin (1.52µm) | Phosphor Bronze |
|
ICS-632-TIC SOCKET, DIP, 32P 2.54MM PITCH |
801 |
|
Datasheet |
ICS | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
|
ED32DTCONN IC DIP SOCKET 32POS TIN |
879 |
|
Datasheet |
ED | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 110°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 60.0µin (1.52µm) | Phosphor Bronze |
|
ICM-306-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 6P |
770 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
A 24-LC/7-TCONN IC DIP SOCKET 24POS TIN |
707 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | 60.0µin (1.52µm) | Phosphor Bronze |
|
A 22-LC-T2CONN IC DIP SOCKET 22POS TIN |
687 |
|
Datasheet |
- | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | 60.0µin (1.52µm) | Phosphor Bronze |
|
A 20-LC-TRCONN IC DIP SOCKET 20POS TIN |
394 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
A 40-LC-TRCONN IC DIP SOCKET 40POS TIN |
143 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
245-32-1-06CONN IC DIP SOCKET 32POS TIN |
873 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole, Kinked Pin | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 60.0µin (1.52µm) | Phosphor Bronze |
|
A 32-LC-TTCONN IC DIP SOCKET 32POS TIN |
845 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
4820-3004-CPCONN IC DIP SOCKET 20POS TIN |
534 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
114-87-308-41-134161CONN IC DIP SOCKET 8POS GOLD |
827 |
|
Datasheet |
114 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
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