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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    4818-3000-CP

    4818-3000-CP

    CONN IC DIP SOCKET 18POS TIN

    3M

    		 756
    RFQ
    		4818-3000-CP

    Datasheet

         		4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    08-3518-10T

    08-3518-10T

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 579
    RFQ
    		08-3518-10T

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICM-324-1-GT-HT

    ICM-324-1-GT-HT

    MACHINE PIN SOCKET, IC, DIP, 24P

    Adam Tech

    		 215
    RFQ
    		ICM-324-1-GT-HT

    Datasheet

         		ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    SA183000

    SA183000

    CONN IC DIP SOCKET 18POS GOLD

    On Shore Technology Inc.

    		 769
    RFQ
    		SA183000

    Datasheet

         		SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    06-0518-10

    06-0518-10

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    		 717
    RFQ
    		06-0518-10

    Datasheet

         		518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICM-628-1-GT-HT

    ICM-628-1-GT-HT

    MACHINE PIN SOCKET, IC, DIP, 28P

    Adam Tech

    		 706
    RFQ
    		ICM-628-1-GT-HT

    Datasheet

         		ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    A-CCS 028-Z-SM

    A-CCS 028-Z-SM

    CONN SOCKET PLCC 28POS TIN

    Assmann WSW Components

    		 77
    RFQ
    		A-CCS 028-Z-SM

    Datasheet

         		- Tube Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
    917-47-108-41-005000

    917-47-108-41-005000

    CONN SOCKET TRANSIST TO-5 8POS

    Mill-Max Manufacturing Corp.

    		 87
    RFQ
    		917-47-108-41-005000

    Datasheet

         		917 Tube Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-47-210-41-005000

    917-47-210-41-005000

    CONN SOCKET TRANSIST TO-5 10POS

    Mill-Max Manufacturing Corp.

    		 31
    RFQ
    		917-47-210-41-005000

    Datasheet

         		917 Tube Active Transistor, TO-100 10 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-308-10-001000

    110-43-308-10-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 55
    RFQ
    		110-43-308-10-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4), 4 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-308-SGT

    ICA-308-SGT

    CONN IC DIP SOCKET 8POS GOLD

    Samtec Inc.

    		 79
    RFQ
    		ICA-308-SGT

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    XR2A-1611-N

    XR2A-1611-N

    CONN IC DIP SOCKET 16POS GOLD

    Omron Electronics Inc-EMC Div

    		 49
    RFQ
    		XR2A-1611-N

    Datasheet

         		XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    110-13-318-41-001000

    110-13-318-41-001000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    		 90
    RFQ
    		110-13-318-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-308-41-001000

    123-13-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 99
    RFQ
    		123-13-308-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-624-41-001000

    110-13-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 48
    RFQ
    		110-13-624-41-001000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-964-41-001000

    110-99-964-41-001000

    CONN IC DIP SOCKET 64POS TINLEAD

    Mill-Max Manufacturing Corp.

    		 95
    RFQ
    		110-99-964-41-001000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-964-41-001000

    110-47-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 42
    RFQ
    		110-47-964-41-001000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-0518-11

    40-0518-11

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    		 85
    RFQ
    		40-0518-11

    Datasheet

         		518 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-526-10

    24-526-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 62
    RFQ
    		24-526-10

    Datasheet

         		Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6554-10

    24-6554-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 63
    RFQ
    		24-6554-10

    Datasheet

         		55 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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