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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    251-5949-02-0602

    251-5949-02-0602

    CONN ZIG-ZAG ZIF 51POS GOLD

    3M

    		 13
    RFQ
    		251-5949-02-0602

    Datasheet

         		Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
    361-PRS19001-12

    361-PRS19001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 16
    RFQ
    		361-PRS19001-12

    Datasheet

         		PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    248-4205-01

    248-4205-01

    CONN SOCKET QFN 48POS GOLD

    3M

    		 14
    RFQ
    		248-4205-01

    Datasheet

         		Textool™ Bulk Active QFN 48 (4 x 12) Gold - Beryllium Copper Through Hole Closed Frame 0.016" (0.40mm) Solder - - Gold Polyethersulfone (PES) - Beryllium Copper
    256-4205-01

    256-4205-01

    CONN SOCKET QFN 56POS GOLD

    3M

    		 8
    RFQ
    		256-4205-01

    Datasheet

         		Textool™ Bulk Active QFN 56 (4 x 14) Gold - Beryllium Copper Through Hole Open Frame 0.016" (0.40mm) Solder 0.016" (0.40mm) - Gold Polyethersulfone (PES) - Beryllium Copper
    280-5205-01

    280-5205-01

    CONN SOCKET QFN 80POS GOLD

    3M

    		 10
    RFQ
    		280-5205-01

    Datasheet

         		Textool™ Bulk Active QFN 80 (4 x 20) Gold - Beryllium Copper Through Hole Open Frame 0.020" (0.50mm) Solder 0.020" (0.50mm) - Gold Polyethersulfone (PES) - Beryllium Copper
    44-547-11E

    44-547-11E

    CONN SOCKET SOIC ZIF 44POS GOLD

    Aries Electronics

    		 10
    RFQ
    		44-547-11E

    Datasheet

         		547 Bulk Active SOIC, ZIF (ZIP) 44 (2 x 22) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame - Solder 0.050" (1.27mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 20.0µin (0.51µm) Beryllium Copper
    110-47-306-41-001000

    110-47-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    		 373
    RFQ
    		110-47-306-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    ED020PLCZ

    ED020PLCZ

    CONN SOCKET PLCC 20POS TIN

    On Shore Technology Inc.

    		 663
    RFQ
    		ED020PLCZ

    Datasheet

         		ED Tube Active PLCC 20 (4 x 5) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
    210-47-308-41-001000

    210-47-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 785
    RFQ
    		210-47-308-41-001000

    Datasheet

         		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    EDO-32PLCZSM

    EDO-32PLCZSM

    CONN SOCKET PLCC 32POS

    On Shore Technology Inc.

    		 712
    RFQ
    		EDO-32PLCZSM

    Datasheet

         		ED Tube Active PLCC 32 (2 x 16) - - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C - Polyphenylene Sulfide (PPS) - Phosphor Bronze
    111-47-306-41-001000

    111-47-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    		 408
    RFQ
    		111-47-306-41-001000

    Datasheet

         		111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    115-47-308-41-001000

    115-47-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 377
    RFQ
    		115-47-308-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    06-0518-10H

    06-0518-10H

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    		 93
    RFQ
    		06-0518-10H

    Datasheet

         		518 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    8432-21A1-RK-TP

    8432-21A1-RK-TP

    CONN SOCKET PLCC 32POS TIN

    3M

    		 78
    RFQ
    		8432-21A1-RK-TP

    Datasheet

         		8400 Tube Active PLCC 32 (2 x 7, 2 x 9) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
    SA486000

    SA486000

    CONN IC DIP SOCKET 48POS GOLD

    On Shore Technology Inc.

    		 33
    RFQ
    		SA486000

    Datasheet

         		SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
    115-43-314-41-001000

    115-43-314-41-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 38
    RFQ
    		115-43-314-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-210-41-006000

    116-43-210-41-006000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    		 78
    RFQ
    		116-43-210-41-006000

    Datasheet

         		116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    ICA-320-STT

    ICA-320-STT

    CONN IC DIP SKT 20POS

    Samtec Inc.

    		 36
    RFQ
    		ICA-320-STT

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
    32-6518-10

    32-6518-10

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 89
    RFQ
    		32-6518-10

    Datasheet

         		518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    ICF-318-T-O

    ICF-318-T-O

    CONN IC DIP SOCKET 18POS TIN

    Samtec Inc.

    		 27
    RFQ
    		ICF-318-T-O

    Datasheet

         		ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
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