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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    251-5949-02-0602

    251-5949-02-0602

    CONN ZIG-ZAG ZIF 51POS GOLD

    3M

    		 13
    RFQ
    		251-5949-02-0602

    Datasheet

         		Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    361-PRS19001-12

    361-PRS19001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 16
    RFQ
    		361-PRS19001-12

    Datasheet

         		PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    248-4205-01

    248-4205-01

    CONN SOCKET QFN 48POS GOLD

    3M

    		 14
    RFQ
    		248-4205-01

    Datasheet

         		Textool™ Bulk Active QFN 48 (4 x 12) 0.016" (0.40mm) Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
    256-4205-01

    256-4205-01

    CONN SOCKET QFN 56POS GOLD

    3M

    		 8
    RFQ
    		256-4205-01

    Datasheet

         		Textool™ Bulk Active QFN 56 (4 x 14) 0.016" (0.40mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.016" (0.40mm) Gold - Beryllium Copper Polyethersulfone (PES) -
    280-5205-01

    280-5205-01

    CONN SOCKET QFN 80POS GOLD

    3M

    		 10
    RFQ
    		280-5205-01

    Datasheet

         		Textool™ Bulk Active QFN 80 (4 x 20) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.020" (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES) -
    44-547-11E

    44-547-11E

    CONN SOCKET SOIC ZIF 44POS GOLD

    Aries Electronics

    		 10
    RFQ
    		44-547-11E

    Datasheet

         		547 Bulk Active SOIC, ZIF (ZIP) 44 (2 x 22) - Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 20.0µin (0.51µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    110-47-306-41-001000

    110-47-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    		 373
    RFQ
    		110-47-306-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ED020PLCZ

    ED020PLCZ

    CONN SOCKET PLCC 20POS TIN

    On Shore Technology Inc.

    		 663
    RFQ
    		ED020PLCZ

    Datasheet

         		ED Tube Active PLCC 20 (4 x 5) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
    210-47-308-41-001000

    210-47-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 785
    RFQ
    		210-47-308-41-001000

    Datasheet

         		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    EDO-32PLCZSM

    EDO-32PLCZSM

    CONN SOCKET PLCC 32POS

    On Shore Technology Inc.

    		 712
    RFQ
    		EDO-32PLCZSM

    Datasheet

         		ED Tube Active PLCC 32 (2 x 16) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
    111-47-306-41-001000

    111-47-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    		 408
    RFQ
    		111-47-306-41-001000

    Datasheet

         		111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-47-308-41-001000

    115-47-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 377
    RFQ
    		115-47-308-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    06-0518-10H

    06-0518-10H

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    		 93
    RFQ
    		06-0518-10H

    Datasheet

         		518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    8432-21A1-RK-TP

    8432-21A1-RK-TP

    CONN SOCKET PLCC 32POS TIN

    3M

    		 78
    RFQ
    		8432-21A1-RK-TP

    Datasheet

         		8400 Tube Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    SA486000

    SA486000

    CONN IC DIP SOCKET 48POS GOLD

    On Shore Technology Inc.

    		 33
    RFQ
    		SA486000

    Datasheet

         		SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    115-43-314-41-001000

    115-43-314-41-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 38
    RFQ
    		115-43-314-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-210-41-006000

    116-43-210-41-006000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    		 78
    RFQ
    		116-43-210-41-006000

    Datasheet

         		116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-320-STT

    ICA-320-STT

    CONN IC DIP SKT 20POS

    Samtec Inc.

    		 36
    RFQ
    		ICA-320-STT

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    32-6518-10

    32-6518-10

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 89
    RFQ
    		32-6518-10

    Datasheet

         		518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICF-318-T-O

    ICF-318-T-O

    CONN IC DIP SOCKET 18POS TIN

    Samtec Inc.

    		 27
    RFQ
    		ICF-318-T-O

    Datasheet

         		ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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