Hello! now KATY Electronic Technology Co., LTD+8618924632110（Bella)
KATY Electronic Technology Co., LTDMy Inquiry KATY Electronic Technology Co., LTDMy Account
    Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD
    All Categories
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-43-314-41-801000

    110-43-314-41-801000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 80
    RFQ
    		110-43-314-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-93-308-10-001000

    299-93-308-10-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 38
    RFQ
    		299-93-308-10-001000

    Datasheet

         		299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-640-41-001000

    111-93-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    		 76
    RFQ
    		111-93-640-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-316-41-801000

    110-43-316-41-801000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 79
    RFQ
    		110-43-316-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-314-41-001000

    123-13-314-41-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 52
    RFQ
    		123-13-314-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-93-430-41-005000

    117-93-430-41-005000

    CONN IC DIP SOCKET 30POS GOLD

    Mill-Max Manufacturing Corp.

    		 53
    RFQ
    		117-93-430-41-005000

    Datasheet

         		117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-320-41-801000

    110-43-320-41-801000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 98
    RFQ
    		110-43-320-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-93-314-11-001000

    299-93-314-11-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 74
    RFQ
    		299-93-314-11-001000

    Datasheet

         		299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-324-41-001000

    123-93-324-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 52
    RFQ
    		123-93-324-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-624-41-001000

    123-93-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 43
    RFQ
    		123-93-624-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-628-NGT

    ICO-628-NGT

    CONN IC DIP SOCKET 28POS GOLD

    Samtec Inc.

    		 41
    RFQ
    		ICO-628-NGT

    Datasheet

         		ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    110-13-314-41-801000

    110-13-314-41-801000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 67
    RFQ
    		110-13-314-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-6518-10

    48-6518-10

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 73
    RFQ
    		48-6518-10

    Datasheet

         		518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    123-13-316-41-001000

    123-13-316-41-001000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 41
    RFQ
    		123-13-316-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    08-823-90

    08-823-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 58
    RFQ
    		08-823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    XR2P2041

    XR2P2041

    CONN SOCKET SIP 20POS GOLD

    Omron Electronics Inc-EMC Div

    		 96
    RFQ
    		XR2P2041

    Datasheet

         		XR2 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    123-93-328-41-001000

    123-93-328-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 79
    RFQ
    		123-93-328-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-628-41-001000

    123-93-628-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 34
    RFQ
    		123-93-628-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-93-642-41-005000

    117-93-642-41-005000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    		 70
    RFQ
    		117-93-642-41-005000

    Datasheet

         		117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-320-41-801000

    110-13-320-41-801000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 92
    RFQ
    		110-13-320-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 5354555657585960...955Next»
    Fast Shipping
    Fast Shipping Fast and convenient door to door delivery.
    Paypment Security
    Paypment Security More than 5 different secure payment methods.
    Strictly Quality Control
    Strictly Quality Control 365 days After-Sales Service and Warranty
    Simple And Professional
    Simple And Professional One-stop Electronics Procurement Solutions.
    Your email
    Your message
    KATY Electronic Technology Co., LTD

    HOME

     KATY Electronic Technology Co., LTD

    PRODUCT

     KATY Electronic Technology Co., LTD

    PHONE

     KATY Electronic Technology Co., LTD

    USER
    KATY Electronic Technology Co., LTD
    [email protected]