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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0230-T-T

    APH-0230-T-T

    APH-0230-T-T

    Samtec Inc.

    		 4,233
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0730-T-T

    APH-0730-T-T

    APH-0730-T-T

    Samtec Inc.

    		 3,094
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1130-T-T

    APH-1130-T-T

    APH-1130-T-T

    Samtec Inc.

    		 3,775
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    317-43-118-41-005000

    317-43-118-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    		 4,591
    RFQ
    		317-43-118-41-005000

    Datasheet

         		317 Bulk Active SIP 18 (1 x 18) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-316-11-480000

    605-93-316-11-480000

    SOCKET CARRIER LOWPRO .300 16POS

    Mill-Max Manufacturing Corp.

    		 3,627
    RFQ
    		605-93-316-11-480000

    Datasheet

         		605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-316-11-480000

    605-43-316-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 2,362
    RFQ
    		605-43-316-11-480000

    Datasheet

         		605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    17-0501-21

    17-0501-21

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    		 4,933
    RFQ
    		17-0501-21

    Datasheet

         		501 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-4518-10E

    24-4518-10E

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,575
    RFQ
    		24-4518-10E

    Datasheet

         		518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-83-262-20-091101

    510-83-262-20-091101

    CONN SOCKET PGA 262POS GOLD

    Preci-Dip

    		 4,078
    RFQ
    		510-83-262-20-091101

    Datasheet

         		510 Bulk Active PGA 262 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-99-950-41-001000

    110-99-950-41-001000

    CONN IC DIP SOCKET 50POS TINLEAD

    Mill-Max Manufacturing Corp.

    		 4,666
    RFQ
    		110-99-950-41-001000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-950-41-001000

    110-44-950-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,094
    RFQ
    		110-44-950-41-001000

    Datasheet

         		110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-120-41-012000

    346-93-120-41-012000

    SOCKET SLDRLSS PRESSFIT SIP20POS

    Mill-Max Manufacturing Corp.

    		 2,475
    RFQ
    		346-93-120-41-012000

    Datasheet

         		346 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-93-119-41-005000

    317-93-119-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    		 4,093
    RFQ
    		317-93-119-41-005000

    Datasheet

         		317 Bulk Active SIP 19 (1 x 19) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-11-316-41-780000

    104-11-316-41-780000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,039
    RFQ
    		104-11-316-41-780000

    Datasheet

         		104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-41-628-41-012000

    146-41-628-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,920
    RFQ
    		146-41-628-41-012000

    Datasheet

         		146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-91-628-41-012000

    146-91-628-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,477
    RFQ
    		146-91-628-41-012000

    Datasheet

         		146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-320-41-007000

    116-93-320-41-007000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,625
    RFQ
    		116-93-320-41-007000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-420-41-007000

    116-93-420-41-007000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,698
    RFQ
    		116-93-420-41-007000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-320-41-007000

    116-43-320-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,614
    RFQ
    		116-43-320-41-007000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-420-41-007000

    116-43-420-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,979
    RFQ
    		116-43-420-41-007000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 571572573574575576577578...955Next»
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