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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    HLS-0111-G-3

    HLS-0111-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,868
    RFQ
    		HLS-0111-G-3

    Datasheet

         		HLS Bulk Active SIP 11 (1 x 11) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
    38-3503-20

    38-3503-20

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    		 2,667
    RFQ
    		38-3503-20

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    38-3503-30

    38-3503-30

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    		 2,731
    RFQ
    		38-3503-30

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    40-6503-30

    40-6503-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,656
    RFQ
    		40-6503-30

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    24-516-11M

    24-516-11M

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 2,082
    RFQ
    		24-516-11M

    Datasheet

         		516 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
    115-47-652-41-001000

    115-47-652-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 3,446
    RFQ
    		115-47-652-41-001000

    Datasheet

         		115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    42-1508-20

    42-1508-20

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    		 2,982
    RFQ
    		42-1508-20

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    ICO-628-CGG

    ICO-628-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,575
    RFQ
    		ICO-628-CGG

    Datasheet

         		ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    APA-628-G-J

    APA-628-G-J

    ADAPTER PLUG

    Samtec Inc.

    		 4,927
    RFQ
    		APA-628-G-J

    Datasheet

         		APA Bulk Active - 28 (2 x 14) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
    111-41-640-41-001000

    111-41-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,908
    RFQ
    		111-41-640-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    111-91-640-41-001000

    111-91-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,761
    RFQ
    		111-91-640-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    104-13-314-41-780000

    104-13-314-41-780000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,078
    RFQ
    		104-13-314-41-780000

    Datasheet

         		104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
    16-C280-20

    16-C280-20

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 3,111
    RFQ
    		16-C280-20

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    24-6508-202

    24-6508-202

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,321
    RFQ
    		24-6508-202

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    146-93-422-41-012000

    146-93-422-41-012000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,271
    RFQ
    		146-93-422-41-012000

    Datasheet

         		146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    146-43-422-41-012000

    146-43-422-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,390
    RFQ
    		146-43-422-41-012000

    Datasheet

         		146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    APH-0930-T-T

    APH-0930-T-T

    APH-0930-T-T

    Samtec Inc.

    		 2,137
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0530-T-T

    APH-0530-T-T

    APH-0530-T-T

    Samtec Inc.

    		 4,520
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0630-T-T

    APH-0630-T-T

    APH-0630-T-T

    Samtec Inc.

    		 2,182
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1230-T-T

    APH-1230-T-T

    APH-1230-T-T

    Samtec Inc.

    		 4,356
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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