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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    33-0501-30

    33-0501-30

    CONN SOCKET SIP 33POS TIN

    Aries Electronics

    		 2,019
    RFQ
    		33-0501-30

    Datasheet

         		501 Bulk Active SIP 33 (1 x 33) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    317-93-108-41-005000

    317-93-108-41-005000

    SHRINK DIP SOCKET 8 PIN

    Mill-Max Manufacturing Corp.

    		 2,396
    RFQ

    -

    		 317 Tube Active SIP 8 (1 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    517-87-293-18-101111

    517-87-293-18-101111

    CONN SOCKET PGA 293POS GOLD

    Preci-Dip

    		 3,923
    RFQ
    		517-87-293-18-101111

    Datasheet

         		517 Bulk Active PGA 293 (18 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    40-9513-11

    40-9513-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,426
    RFQ
    		40-9513-11

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    110-13-322-41-001000

    110-13-322-41-001000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,361
    RFQ
    		110-13-322-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    110-13-422-41-001000

    110-13-422-41-001000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,529
    RFQ
    		110-13-422-41-001000

    Datasheet

         		110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    26-81250-310C

    26-81250-310C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 3,562
    RFQ
    		26-81250-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    26-81250-610C

    26-81250-610C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 2,220
    RFQ
    		26-81250-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    26-8350-310C

    26-8350-310C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 4,419
    RFQ
    		26-8350-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    26-8530-310C

    26-8530-310C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 4,430
    RFQ
    		26-8530-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    26-8900-310C

    26-8900-310C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 3,893
    RFQ
    		26-8900-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    26-8975-310C

    26-8975-310C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 4,178
    RFQ
    		26-8975-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    26-8984-310C

    26-8984-310C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 4,208
    RFQ
    		26-8984-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    APH-0428-T-R

    APH-0428-T-R

    APH-0428-T-R

    Samtec Inc.

    		 3,506
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1828-T-R

    APH-1828-T-R

    APH-1828-T-R

    Samtec Inc.

    		 2,907
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0528-T-R

    APH-0528-T-R

    APH-0528-T-R

    Samtec Inc.

    		 2,018
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1428-T-R

    APH-1428-T-R

    APH-1428-T-R

    Samtec Inc.

    		 2,368
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1528-T-R

    APH-1528-T-R

    APH-1528-T-R

    Samtec Inc.

    		 3,787
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1928-T-R

    APH-1928-T-R

    APH-1928-T-R

    Samtec Inc.

    		 3,832
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0628-T-R

    APH-0628-T-R

    APH-0628-T-R

    Samtec Inc.

    		 2,798
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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