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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    27-0508-31

    27-0508-31

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    		 2,012
    RFQ
    		27-0508-31

    Datasheet

         		508 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    APH-1838-T-H

    APH-1838-T-H

    APH-1838-T-H

    Samtec Inc.

    		 2,378
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0938-T-H

    APH-0938-T-H

    APH-0938-T-H

    Samtec Inc.

    		 3,851
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1038-T-H

    APH-1038-T-H

    APH-1038-T-H

    Samtec Inc.

    		 4,123
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0538-T-H

    APH-0538-T-H

    APH-0538-T-H

    Samtec Inc.

    		 4,059
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1938-T-H

    APH-1938-T-H

    APH-1938-T-H

    Samtec Inc.

    		 2,928
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1538-T-H

    APH-1538-T-H

    APH-1538-T-H

    Samtec Inc.

    		 3,464
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0238-T-H

    APH-0238-T-H

    APH-0238-T-H

    Samtec Inc.

    		 3,536
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1238-T-H

    APH-1238-T-H

    APH-1238-T-H

    Samtec Inc.

    		 2,285
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0338-T-H

    APH-0338-T-H

    APH-0338-T-H

    Samtec Inc.

    		 4,822
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0738-T-H

    APH-0738-T-H

    APH-0738-T-H

    Samtec Inc.

    		 3,252
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1138-T-H

    APH-1138-T-H

    APH-1138-T-H

    Samtec Inc.

    		 2,795
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-41-432-41-001000

    116-41-432-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,217
    RFQ
    		116-41-432-41-001000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-41-632-41-001000

    116-41-632-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,705
    RFQ
    		116-41-632-41-001000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-91-432-41-001000

    116-91-432-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,870
    RFQ
    		116-91-432-41-001000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-91-632-41-001000

    116-91-632-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,233
    RFQ
    		116-91-632-41-001000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-41-640-41-008000

    116-41-640-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,559
    RFQ
    		116-41-640-41-008000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-91-640-41-008000

    116-91-640-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,095
    RFQ
    		116-91-640-41-008000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    114-41-952-41-117000

    114-41-952-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,798
    RFQ
    		114-41-952-41-117000

    Datasheet

         		114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    114-91-952-41-117000

    114-91-952-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,702
    RFQ
    		114-91-952-41-117000

    Datasheet

         		114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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