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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    110-13-642-41-001000

    110-13-642-41-001000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    4,244
    RFQ
    110-13-642-41-001000

    Datasheet

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    132-PGM14015-10

    132-PGM14015-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,808
    RFQ
    132-PGM14015-10

    Datasheet

    PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    116-47-952-41-006000

    116-47-952-41-006000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    3,304
    RFQ
    116-47-952-41-006000

    Datasheet

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    714-43-232-31-018000

    714-43-232-31-018000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    3,101
    RFQ
    714-43-232-31-018000

    Datasheet

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
    APH-1340-T-T

    APH-1340-T-T

    APH-1340-T-T

    Samtec Inc.

    3,590
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0840-T-T

    APH-0840-T-T

    APH-0840-T-T

    Samtec Inc.

    3,649
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0440-T-T

    APH-0440-T-T

    APH-0440-T-T

    Samtec Inc.

    2,475
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0940-T-T

    APH-0940-T-T

    APH-0940-T-T

    Samtec Inc.

    2,427
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1440-T-T

    APH-1440-T-T

    APH-1440-T-T

    Samtec Inc.

    2,713
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1940-T-T

    APH-1940-T-T

    APH-1940-T-T

    Samtec Inc.

    4,284
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0540-T-T

    APH-0540-T-T

    APH-0540-T-T

    Samtec Inc.

    2,277
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1040-T-T

    APH-1040-T-T

    APH-1040-T-T

    Samtec Inc.

    2,536
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0740-T-T

    APH-0740-T-T

    APH-0740-T-T

    Samtec Inc.

    3,848
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0240-T-T

    APH-0240-T-T

    APH-0240-T-T

    Samtec Inc.

    3,632
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0640-T-T

    APH-0640-T-T

    APH-0640-T-T

    Samtec Inc.

    4,616
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1640-T-T

    APH-1640-T-T

    APH-1640-T-T

    Samtec Inc.

    4,183
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1140-T-T

    APH-1140-T-T

    APH-1140-T-T

    Samtec Inc.

    2,068
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0340-T-T

    APH-0340-T-T

    APH-0340-T-T

    Samtec Inc.

    4,793
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    24-526-11

    24-526-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    3,756
    RFQ
    24-526-11

    Datasheet

    Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
    612-41-328-41-004000

    612-41-328-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,404
    RFQ
    612-41-328-41-004000

    Datasheet

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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