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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    36-6556-20

    36-6556-20

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 4,177
    RFQ
    		36-6556-20

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
    30-6621-30

    30-6621-30

    CONN IC DIP SOCKET 30POS TIN

    Aries Electronics

    		 3,403
    RFQ
    		30-6621-30

    Datasheet

         		6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    40-7950-10

    40-7950-10

    CONN SOCKET SIP 40POS TIN

    Aries Electronics

    		 2,482
    RFQ
    		40-7950-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 40 (1 x 40) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    614-41-636-31-002000

    614-41-636-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,206
    RFQ
    		614-41-636-31-002000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    614-91-636-31-002000

    614-91-636-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,581
    RFQ
    		614-91-636-31-002000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-47-650-41-007000

    116-47-650-41-007000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,288
    RFQ
    		116-47-650-41-007000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    614-41-636-31-007000

    614-41-636-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,696
    RFQ
    		614-41-636-31-007000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    614-91-636-31-007000

    614-91-636-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,618
    RFQ
    		614-91-636-31-007000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    APA-318-G-Q

    APA-318-G-Q

    ADAPTER PLUG

    Samtec Inc.

    		 4,999
    RFQ
    		APA-318-G-Q

    Datasheet

         		APA Tube Active - 18 (2 x 9) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
    40-3575-10

    40-3575-10

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 3,141
    RFQ
    		40-3575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    40-6571-10

    40-6571-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 4,709
    RFQ
    		40-6571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    40-6573-10

    40-6573-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 3,120
    RFQ
    		40-6573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    40-6575-10

    40-6575-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 2,476
    RFQ
    		40-6575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    HLS-0414-S-2

    HLS-0414-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,021
    RFQ
    		HLS-0414-S-2

    Datasheet

         		HLS Bulk Active SIP 56 (4 x 14) Gold - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    32-6575-10

    32-6575-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 4,675
    RFQ
    		32-6575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    32-6574-10

    32-6574-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 3,310
    RFQ
    		32-6574-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    126-41-636-41-001000

    126-41-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,525
    RFQ
    		126-41-636-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-91-636-41-001000

    126-91-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,698
    RFQ
    		126-91-636-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    517-87-364-17-091111

    517-87-364-17-091111

    CONN SOCKET PGA 364POS GOLD

    Preci-Dip

    		 3,914
    RFQ
    		517-87-364-17-091111

    Datasheet

         		517 Bulk Active PGA 364 (17 x 17) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    28-8350-610C

    28-8350-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 3,473
    RFQ
    		28-8350-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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