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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    612-41-428-41-004000

    612-41-428-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,755
    RFQ
    		612-41-428-41-004000

    Datasheet

         		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-628-41-004000

    612-41-628-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,558
    RFQ
    		612-41-628-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-328-41-004000

    612-91-328-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,529
    RFQ
    		612-91-328-41-004000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-428-41-004000

    612-91-428-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,971
    RFQ
    		612-91-428-41-004000

    Datasheet

         		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-628-41-004000

    612-91-628-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,268
    RFQ
    		612-91-628-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-636-31-012000

    614-41-636-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,428
    RFQ
    		614-41-636-31-012000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-636-31-012000

    614-91-636-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,335
    RFQ
    		614-91-636-31-012000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    546-83-133-14-002135

    546-83-133-14-002135

    CONN SOCKET PGA 133POS GOLD

    Preci-Dip

    		 2,390
    RFQ
    		546-83-133-14-002135

    Datasheet

         		546 Bulk Active PGA 133 (14 x 14) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-316-G-H

    APO-316-G-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,947
    RFQ
    		APO-316-G-H

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    22-0511-11

    22-0511-11

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    		 2,565
    RFQ
    		22-0511-11

    Datasheet

         		511 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    48-3552-10

    48-3552-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 4,983
    RFQ
    		48-3552-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3553-10

    48-3553-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 3,220
    RFQ
    		48-3553-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6551-10

    48-6551-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 2,151
    RFQ
    		48-6551-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6552-10

    48-6552-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 2,097
    RFQ
    		48-6552-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3554-10

    48-3554-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 2,033
    RFQ
    		48-3554-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6553-10

    48-6553-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 4,875
    RFQ
    		48-6553-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-7553-10

    32-7553-10

    CONN SOCKET SIP 32POS TIN

    Aries Electronics

    		 4,273
    RFQ
    		32-7553-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    26-0508-21

    26-0508-21

    CONN SOCKET SIP 26POS GOLD

    Aries Electronics

    		 4,739
    RFQ
    		26-0508-21

    Datasheet

         		508 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    26-0508-31

    26-0508-31

    CONN SOCKET SIP 26POS GOLD

    Aries Electronics

    		 2,875
    RFQ
    		26-0508-31

    Datasheet

         		508 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    120-PGM13015-10

    120-PGM13015-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,161
    RFQ
    		120-PGM13015-10

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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