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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    146-93-640-41-013000

    146-93-640-41-013000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,626
    RFQ
    		146-93-640-41-013000

    Datasheet

         		146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-43-640-41-013000

    146-43-640-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,712
    RFQ
    		146-43-640-41-013000

    Datasheet

         		146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-41-640-11-480000

    605-41-640-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 3,681
    RFQ
    		605-41-640-11-480000

    Datasheet

         		605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-640-11-480000

    605-91-640-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 2,269
    RFQ
    		605-91-640-11-480000

    Datasheet

         		605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-322-41-801000

    110-13-322-41-801000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,302
    RFQ
    		110-13-322-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-3571-10

    36-3571-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 3,704
    RFQ
    		36-3571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3572-10

    36-3572-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 3,612
    RFQ
    		36-3572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3574-10

    36-3574-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 4,949
    RFQ
    		36-3574-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3575-10

    36-3575-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 2,907
    RFQ
    		36-3575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6571-10

    36-6571-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 3,690
    RFQ
    		36-6571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6572-10

    36-6572-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 4,727
    RFQ
    		36-6572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6573-10

    36-6573-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 4,565
    RFQ
    		36-6573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6574-10

    36-6574-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 3,645
    RFQ
    		36-6574-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6575-10

    36-6575-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 2,528
    RFQ
    		36-6575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    123-91-636-41-001000

    123-91-636-41-001000

    SOCKET IC OPEN 3 LVL .600 36POS

    Mill-Max Manufacturing Corp.

    		 2,706
    RFQ

    -

    		 123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-636-41-001000

    123-41-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,949
    RFQ
    		123-41-636-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-632-G-M

    APA-632-G-M

    ADAPTER PLUG

    Samtec Inc.

    		 3,626
    RFQ
    		APA-632-G-M

    Datasheet

         		APA Tube Active - 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    612-13-322-41-001000

    612-13-322-41-001000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,284
    RFQ
    		612-13-322-41-001000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-422-41-001000

    612-13-422-41-001000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,541
    RFQ
    		612-13-422-41-001000

    Datasheet

         		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    44-6551-10

    44-6551-10

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    		 3,856
    RFQ
    		44-6551-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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