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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1030-T-T

    APH-1030-T-T

    APH-1030-T-T

    Samtec Inc.

    3,506
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1530-T-T

    APH-1530-T-T

    APH-1530-T-T

    Samtec Inc.

    2,868
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1630-T-T

    APH-1630-T-T

    APH-1630-T-T

    Samtec Inc.

    4,827
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1330-T-T

    APH-1330-T-T

    APH-1330-T-T

    Samtec Inc.

    4,525
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0830-T-T

    APH-0830-T-T

    APH-0830-T-T

    Samtec Inc.

    3,145
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0330-T-T

    APH-0330-T-T

    APH-0330-T-T

    Samtec Inc.

    3,153
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1730-T-T

    APH-1730-T-T

    APH-1730-T-T

    Samtec Inc.

    4,330
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    116-41-652-41-003000

    116-41-652-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,191
    RFQ
    116-41-652-41-003000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-652-41-003000

    116-91-652-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,962
    RFQ
    116-91-652-41-003000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-0503-21

    24-0503-21

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    3,238
    RFQ
    24-0503-21

    Datasheet

    0503 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    24-0503-31

    24-0503-31

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    2,304
    RFQ
    24-0503-31

    Datasheet

    0503 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    30-0501-21

    30-0501-21

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    2,809
    RFQ
    30-0501-21

    Datasheet

    501 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    30-0501-31

    30-0501-31

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    2,131
    RFQ
    30-0501-31

    Datasheet

    501 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    39-0501-20

    39-0501-20

    CONN SOCKET SIP 39POS TIN

    Aries Electronics

    3,231
    RFQ
    39-0501-20

    Datasheet

    501 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-6508-20

    40-6508-20

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,759
    RFQ
    40-6508-20

    Datasheet

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-6508-30

    40-6508-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,102
    RFQ
    40-6508-30

    Datasheet

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-93-608-10-002000

    299-93-608-10-002000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    2,235
    RFQ
    299-93-608-10-002000

    Datasheet

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    20-3508-212

    20-3508-212

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,869
    RFQ
    20-3508-212

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-3508-312

    20-3508-312

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,638
    RFQ
    20-3508-312

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-93-642-41-003000

    116-93-642-41-003000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    2,587
    RFQ
    116-93-642-41-003000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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