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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APH-1030-T-T

    APH-1030-T-T

    APH-1030-T-T

    Samtec Inc.

    		 3,506
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1530-T-T

    APH-1530-T-T

    APH-1530-T-T

    Samtec Inc.

    		 2,868
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1630-T-T

    APH-1630-T-T

    APH-1630-T-T

    Samtec Inc.

    		 4,827
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1330-T-T

    APH-1330-T-T

    APH-1330-T-T

    Samtec Inc.

    		 4,525
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0830-T-T

    APH-0830-T-T

    APH-0830-T-T

    Samtec Inc.

    		 3,145
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0330-T-T

    APH-0330-T-T

    APH-0330-T-T

    Samtec Inc.

    		 3,153
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1730-T-T

    APH-1730-T-T

    APH-1730-T-T

    Samtec Inc.

    		 4,330
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-41-652-41-003000

    116-41-652-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,191
    RFQ
    		116-41-652-41-003000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-91-652-41-003000

    116-91-652-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,962
    RFQ
    		116-91-652-41-003000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    24-0503-21

    24-0503-21

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    		 3,238
    RFQ
    		24-0503-21

    Datasheet

         		0503 Bulk Active SIP 24 (1 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    24-0503-31

    24-0503-31

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    		 2,304
    RFQ
    		24-0503-31

    Datasheet

         		0503 Bulk Active SIP 24 (1 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    30-0501-21

    30-0501-21

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    		 2,809
    RFQ
    		30-0501-21

    Datasheet

         		501 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    30-0501-31

    30-0501-31

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    		 2,131
    RFQ
    		30-0501-31

    Datasheet

         		501 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    39-0501-20

    39-0501-20

    CONN SOCKET SIP 39POS TIN

    Aries Electronics

    		 3,231
    RFQ
    		39-0501-20

    Datasheet

         		501 Bulk Active SIP 39 (1 x 39) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    40-6508-20

    40-6508-20

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,759
    RFQ
    		40-6508-20

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    40-6508-30

    40-6508-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,102
    RFQ
    		40-6508-30

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    299-93-608-10-002000

    299-93-608-10-002000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,235
    RFQ
    		299-93-608-10-002000

    Datasheet

         		299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    20-3508-212

    20-3508-212

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 2,869
    RFQ
    		20-3508-212

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    20-3508-312

    20-3508-312

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 2,638
    RFQ
    		20-3508-312

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    116-93-642-41-003000

    116-93-642-41-003000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,587
    RFQ
    		116-93-642-41-003000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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