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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    122-13-624-41-001000

    122-13-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,538
    RFQ
    		122-13-624-41-001000

    Datasheet

         		122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0928-T-R

    APH-0928-T-R

    APH-0928-T-R

    Samtec Inc.

    		 2,630
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0728-T-R

    APH-0728-T-R

    APH-0728-T-R

    Samtec Inc.

    		 3,537
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1228-T-R

    APH-1228-T-R

    APH-1228-T-R

    Samtec Inc.

    		 4,794
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0228-T-R

    APH-0228-T-R

    APH-0228-T-R

    Samtec Inc.

    		 2,358
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1628-T-R

    APH-1628-T-R

    APH-1628-T-R

    Samtec Inc.

    		 4,410
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    44-6556-30

    44-6556-30

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    		 3,974
    RFQ
    		44-6556-30

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    44-6556-20

    44-6556-20

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    		 4,640
    RFQ
    		44-6556-20

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    24-3551-11

    24-3551-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 3,278
    RFQ
    		24-3551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3552-11

    24-3552-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 3,471
    RFQ
    		24-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3553-11

    24-3553-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 2,522
    RFQ
    		24-3553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6551-11

    24-6551-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 3,196
    RFQ
    		24-6551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6552-11

    24-6552-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 3,414
    RFQ
    		24-6552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3554-11

    24-3554-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 2,481
    RFQ
    		24-3554-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    210790-4

    210790-4

    CONN SOCKET PGA 128POS GOLD

    TE Connectivity AMP Connectors

    		 3,167
    RFQ
    		210790-4

    Datasheet

         		STA Bulk Obsolete PGA 128 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 118.1µin (3.00µm) Phosphor Bronze Thermoplastic, Polyester, Glass Filled -
    24-3503-31

    24-3503-31

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,390
    RFQ
    		24-3503-31

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6572-10

    40-6572-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 2,450
    RFQ
    		40-6572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    APA-648-T-C

    APA-648-T-C

    ADAPTER PLUG

    Samtec Inc.

    		 3,079
    RFQ
    		APA-648-T-C

    Datasheet

         		APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    126-93-432-41-001000

    126-93-432-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,047
    RFQ
    		126-93-432-41-001000

    Datasheet

         		126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-632-41-001000

    126-93-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,996
    RFQ
    		126-93-632-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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