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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
APH-0316-G-HAPH-0316-G-H |
4,101 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0816-G-HAPH-0816-G-H |
2,079 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1216-G-HAPH-1216-G-H |
2,092 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
117-41-640-41-105000CONN IC SKT DBL |
2,227 |
|
Datasheet |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
126-41-432-41-002000CONN IC SKT DBL |
2,858 |
|
Datasheet |
126 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
126-41-632-41-002000CONN IC SKT DBL |
2,608 |
|
Datasheet |
126 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
126-91-432-41-002000CONN IC SKT DBL |
2,469 |
|
Datasheet |
126 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
126-91-632-41-002000CONN IC SKT DBL |
2,519 |
|
Datasheet |
126 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
714-43-158-31-018000CONN SOCKET SIP 58POS GOLD |
3,187 |
|
Datasheet |
714 | Bulk | Active | SIP | 58 (1 x 58) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 30.0µin (0.76µm) | Brass Alloy |
|
|
117-47-668-41-005000STANDRD SOLDRTL |
3,380 |
|
Datasheet |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 68 (2 x 34) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
546-87-178-18-111135CONN SOCKET PGA 178POS GOLD |
2,339 |
|
Datasheet |
546 | Bulk | Active | PGA | 178 (18 x 18) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.050" (1.27mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Bronze |
|
|
117-93-648-41-005000CONN IC DIP SOCKET 48POS GOLD |
2,556 |
|
Datasheet |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
124-PGM13009-10CONN SOCKET PGA GOLD |
3,764 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
550-10-100-15-001101PGA SOLDER TAIL |
3,148 |
|
Datasheet |
550 | Bulk | Active | PGA | 100 (15 x 15) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
33-0501-21CONN SOCKET SIP 33POS GOLD |
2,452 |
|
Datasheet |
501 | Bulk | Active | SIP | 33 (1 x 33) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
|
|
35-0501-20CONN SOCKET SIP 35POS TIN |
3,816 |
|
Datasheet |
501 | Bulk | Active | SIP | 35 (1 x 35) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
35-0501-30CONN SOCKET SIP 35POS TIN |
3,721 |
|
Datasheet |
501 | Bulk | Active | SIP | 35 (1 x 35) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
614-91-640-31-012000SKT CARRIER PGA |
2,159 |
|
Datasheet |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
122-13-324-41-001000CONN IC DIP SOCKET 24POS GOLD |
3,633 |
|
Datasheet |
122 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
|
122-13-424-41-001000CONN IC DIP SOCKET 24POS GOLD |
3,688 |
|
Datasheet |
122 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
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