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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0316-G-H

    APH-0316-G-H

    APH-0316-G-H

    Samtec Inc.

    		 4,101
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0816-G-H

    APH-0816-G-H

    APH-0816-G-H

    Samtec Inc.

    		 2,079
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1216-G-H

    APH-1216-G-H

    APH-1216-G-H

    Samtec Inc.

    		 2,092
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    117-41-640-41-105000

    117-41-640-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,227
    RFQ
    		117-41-640-41-105000

    Datasheet

         		117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-432-41-002000

    126-41-432-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,858
    RFQ
    		126-41-432-41-002000

    Datasheet

         		126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-632-41-002000

    126-41-632-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,608
    RFQ
    		126-41-632-41-002000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-432-41-002000

    126-91-432-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,469
    RFQ
    		126-91-432-41-002000

    Datasheet

         		126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-632-41-002000

    126-91-632-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,519
    RFQ
    		126-91-632-41-002000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-158-31-018000

    714-43-158-31-018000

    CONN SOCKET SIP 58POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,187
    RFQ
    		714-43-158-31-018000

    Datasheet

         		714 Bulk Active SIP 58 (1 x 58) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-47-668-41-005000

    117-47-668-41-005000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,380
    RFQ
    		117-47-668-41-005000

    Datasheet

         		117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    546-87-178-18-111135

    546-87-178-18-111135

    CONN SOCKET PGA 178POS GOLD

    Preci-Dip

    		 2,339
    RFQ
    		546-87-178-18-111135

    Datasheet

         		546 Bulk Active PGA 178 (18 x 18) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-93-648-41-005000

    117-93-648-41-005000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,556
    RFQ
    		117-93-648-41-005000

    Datasheet

         		117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-PGM13009-10

    124-PGM13009-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,764
    RFQ
    		124-PGM13009-10

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    550-10-100-15-001101

    550-10-100-15-001101

    PGA SOLDER TAIL

    Preci-Dip

    		 3,148
    RFQ
    		550-10-100-15-001101

    Datasheet

         		550 Bulk Active PGA 100 (15 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    33-0501-21

    33-0501-21

    CONN SOCKET SIP 33POS GOLD

    Aries Electronics

    		 2,452
    RFQ
    		33-0501-21

    Datasheet

         		501 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    35-0501-20

    35-0501-20

    CONN SOCKET SIP 35POS TIN

    Aries Electronics

    		 3,816
    RFQ
    		35-0501-20

    Datasheet

         		501 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    35-0501-30

    35-0501-30

    CONN SOCKET SIP 35POS TIN

    Aries Electronics

    		 3,721
    RFQ
    		35-0501-30

    Datasheet

         		501 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-91-640-31-012000

    614-91-640-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,159
    RFQ
    		614-91-640-31-012000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-324-41-001000

    122-13-324-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,633
    RFQ
    		122-13-324-41-001000

    Datasheet

         		122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-424-41-001000

    122-13-424-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,688
    RFQ
    		122-13-424-41-001000

    Datasheet

         		122 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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