Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0816-G-R

    APH-0816-G-R

    APH-0816-G-R

    Samtec Inc.

    2,331
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1316-G-R

    APH-1316-G-R

    APH-1316-G-R

    Samtec Inc.

    4,584
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0716-G-R

    APH-0716-G-R

    APH-0716-G-R

    Samtec Inc.

    4,924
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0316-G-R

    APH-0316-G-R

    APH-0316-G-R

    Samtec Inc.

    2,866
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1216-G-R

    APH-1216-G-R

    APH-1216-G-R

    Samtec Inc.

    3,559
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    123-11-642-41-001000

    123-11-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,197
    RFQ
    123-11-642-41-001000

    Datasheet

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-628-G-H

    APO-628-G-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,308
    RFQ
    APO-628-G-H

    Datasheet

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    126-93-650-41-002000

    126-93-650-41-002000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    2,951
    RFQ
    126-93-650-41-002000

    Datasheet

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-650-41-002000

    126-43-650-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,832
    RFQ
    126-43-650-41-002000

    Datasheet

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-6621-30

    48-6621-30

    CONN IC DIP SOCKET 48POS TIN

    Aries Electronics

    3,306
    RFQ
    48-6621-30

    Datasheet

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    225-PGM15001-10

    225-PGM15001-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,035
    RFQ
    225-PGM15001-10

    Datasheet

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-99-964-61-001000

    110-99-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,258
    RFQ

    -

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-952-41-004000

    612-41-952-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,183
    RFQ
    612-41-952-41-004000

    Datasheet

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-952-41-004000

    612-91-952-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,142
    RFQ
    612-91-952-41-004000

    Datasheet

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-11-648-41-001000

    122-11-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,162
    RFQ
    122-11-648-41-001000

    Datasheet

    122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-652-41-001000

    116-93-652-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    2,386
    RFQ
    116-93-652-41-001000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-652-41-001000

    116-43-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,442
    RFQ
    116-43-652-41-001000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-640-61-001000

    115-93-640-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,053
    RFQ

    -

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-314-61-105000

    110-43-314-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,940
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-314-61-105000

    110-93-314-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,540
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 784785786787788789790791...955Next»
    Your email
    Your message
    KATY Electronic Technology Co., LTD

    HOME

    KATY Electronic Technology Co., LTD

    PRODUCT

    KATY Electronic Technology Co., LTD

    PHONE

    KATY Electronic Technology Co., LTD

    USER