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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APH-0816-G-R

    APH-0816-G-R

    APH-0816-G-R

    Samtec Inc.

    		 2,331
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1316-G-R

    APH-1316-G-R

    APH-1316-G-R

    Samtec Inc.

    		 4,584
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0716-G-R

    APH-0716-G-R

    APH-0716-G-R

    Samtec Inc.

    		 4,924
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0316-G-R

    APH-0316-G-R

    APH-0316-G-R

    Samtec Inc.

    		 2,866
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1216-G-R

    APH-1216-G-R

    APH-1216-G-R

    Samtec Inc.

    		 3,559
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    123-11-642-41-001000

    123-11-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,197
    RFQ
    		123-11-642-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    APO-628-G-H

    APO-628-G-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,308
    RFQ
    		APO-628-G-H

    Datasheet

         		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    126-93-650-41-002000

    126-93-650-41-002000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,951
    RFQ
    		126-93-650-41-002000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-43-650-41-002000

    126-43-650-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,832
    RFQ
    		126-43-650-41-002000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    48-6621-30

    48-6621-30

    CONN IC DIP SOCKET 48POS TIN

    Aries Electronics

    		 3,306
    RFQ
    		48-6621-30

    Datasheet

         		6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    225-PGM15001-10

    225-PGM15001-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,035
    RFQ
    		225-PGM15001-10

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    110-99-964-61-001000

    110-99-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,258
    RFQ

    -

    		 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    612-41-952-41-004000

    612-41-952-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,183
    RFQ
    		612-41-952-41-004000

    Datasheet

         		612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    612-91-952-41-004000

    612-91-952-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,142
    RFQ
    		612-91-952-41-004000

    Datasheet

         		612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    122-11-648-41-001000

    122-11-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,162
    RFQ
    		122-11-648-41-001000

    Datasheet

         		122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    116-93-652-41-001000

    116-93-652-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,386
    RFQ
    		116-93-652-41-001000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-652-41-001000

    116-43-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,442
    RFQ
    		116-43-652-41-001000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    115-93-640-61-001000

    115-93-640-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,053
    RFQ

    -

    		 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-43-314-61-105000

    110-43-314-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,940
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-93-314-61-105000

    110-93-314-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,540
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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