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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    HLS-0513-T-10

    HLS-0513-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,881
    RFQ
    		HLS-0513-T-10

    Datasheet

         		HLS Bulk Active SIP 65 (5 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-93-322-61-001000

    110-93-322-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,780
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-91-032-09-041003

    510-91-032-09-041003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,262
    RFQ
    		510-91-032-09-041003

    Datasheet

         		510 Bulk Active PGA 32 (9 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-83-144-15-081112

    614-83-144-15-081112

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    		 2,970
    RFQ
    		614-83-144-15-081112

    Datasheet

         		614 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-43-628-61-006000

    116-43-628-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,062
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-428-61-006000

    116-93-428-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,400
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-628-61-006000

    116-93-628-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,813
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-93-626-10-002000

    299-93-626-10-002000

    CONN IC DIP SOCKET 26POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,866
    RFQ
    		299-93-626-10-002000

    Datasheet

         		299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-950-41-003000

    612-43-950-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,892
    RFQ
    		612-43-950-41-003000

    Datasheet

         		612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-950-41-003000

    612-93-950-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,860
    RFQ
    		612-93-950-41-003000

    Datasheet

         		612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-13-648-41-001000

    121-13-648-41-001000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,627
    RFQ
    		121-13-648-41-001000

    Datasheet

         		121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-316-61-001000

    111-93-316-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,554
    RFQ

    -

    		 111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-652-41-001000

    612-93-652-41-001000

    SOCKET CARRIER SLDRTL .600 52POS

    Mill-Max Manufacturing Corp.

    		 3,888
    RFQ
    		612-93-652-41-001000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-652-41-001000

    612-43-652-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,779
    RFQ
    		612-43-652-41-001000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-322-61-008000

    116-43-322-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,230
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-422-61-008000

    116-93-422-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,816
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-642-61-001000

    115-93-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,388
    RFQ

    -

    		 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-320-61-001000

    116-43-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,489
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-43-428-61-005000

    117-43-428-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,286
    RFQ

    -

    		 117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-432-61-001000

    110-41-432-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,964
    RFQ

    -

    		 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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