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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-91-632-61-001000

    110-91-632-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,958
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-952-61-001000

    110-91-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,897
    RFQ

    -

    		 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-0508-21

    36-0508-21

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    		 4,610
    RFQ
    		36-0508-21

    Datasheet

         		508 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    36-0508-31

    36-0508-31

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    		 3,358
    RFQ
    		36-0508-31

    Datasheet

         		508 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    104-13-952-41-770000

    104-13-952-41-770000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,961
    RFQ
    		104-13-952-41-770000

    Datasheet

         		104 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    104-13-950-41-780000

    104-13-950-41-780000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,730
    RFQ
    		104-13-950-41-780000

    Datasheet

         		104 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    36-1508-21

    36-1508-21

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 3,764
    RFQ
    		36-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    36-1508-31

    36-1508-31

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 2,634
    RFQ
    		36-1508-31

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    124-41-652-41-002000

    124-41-652-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,879
    RFQ
    		124-41-652-41-002000

    Datasheet

         		124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-41-952-41-002000

    124-41-952-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,491
    RFQ
    		124-41-952-41-002000

    Datasheet

         		124 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-652-41-002000

    124-91-652-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,817
    RFQ
    		124-91-652-41-002000

    Datasheet

         		124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-952-41-002000

    124-91-952-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,614
    RFQ
    		124-91-952-41-002000

    Datasheet

         		124 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-93-264-31-007000

    714-93-264-31-007000

    SOCKET CARRIER DUAL INLINE 64POS

    Mill-Max Manufacturing Corp.

    		 3,618
    RFQ
    		714-93-264-31-007000

    Datasheet

         		714 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-83-145-15-081112

    614-83-145-15-081112

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    		 2,248
    RFQ
    		614-83-145-15-081112

    Datasheet

         		614 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-93-088-13-062001

    510-93-088-13-062001

    SOCKET SOLDERTAIL 88-PGA

    Mill-Max Manufacturing Corp.

    		 4,388
    RFQ

    -

    		 510 Tube Active PGA 88 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-324-61-008000

    116-43-324-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,192
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-324-61-008000

    116-93-324-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,795
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-424-61-008000

    116-93-424-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,402
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-624-61-008000

    116-93-624-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,628
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-328-41-801000

    123-13-328-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,929
    RFQ
    		123-13-328-41-801000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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