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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1322-G-H

    APH-1322-G-H

    APH-1322-G-H

    Samtec Inc.

    		 4,286
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0822-G-H

    APH-0822-G-H

    APH-0822-G-H

    Samtec Inc.

    		 2,968
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    110-43-318-61-801000

    110-43-318-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,980
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    37-0508-21

    37-0508-21

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    		 4,000
    RFQ
    		37-0508-21

    Datasheet

         		508 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    37-0508-31

    37-0508-31

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    		 3,056
    RFQ
    		37-0508-31

    Datasheet

         		508 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    517-83-296-19-131111

    517-83-296-19-131111

    CONN SOCKET PGA 296POS GOLD

    Preci-Dip

    		 4,282
    RFQ
    		517-83-296-19-131111

    Datasheet

         		517 Bulk Active PGA 296 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-93-648-61-001000

    115-93-648-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,241
    RFQ

    -

    		 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-322-61-001000

    111-43-322-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,357
    RFQ

    -

    		 111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-422-61-001000

    111-43-422-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,063
    RFQ

    -

    		 111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-322-61-001000

    111-93-322-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,248
    RFQ

    -

    		 111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-422-61-001000

    111-93-422-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,047
    RFQ

    -

    		 111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-9503-21

    32-9503-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,489
    RFQ
    		32-9503-21

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-9503-31

    32-9503-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 4,307
    RFQ
    		32-9503-31

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    117-43-764-41-105000

    117-43-764-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,067
    RFQ
    		117-43-764-41-105000

    Datasheet

         		117 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-83-149-15-063112

    614-83-149-15-063112

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    		 3,414
    RFQ
    		614-83-149-15-063112

    Datasheet

         		614 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-41-642-61-001000

    110-41-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,870
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-0511-11

    36-0511-11

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    		 2,107
    RFQ
    		36-0511-11

    Datasheet

         		511 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    546-83-181-15-051135

    546-83-181-15-051135

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    		 2,925
    RFQ
    		546-83-181-15-051135

    Datasheet

         		546 Bulk Active PGA 181 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-83-181-15-051136

    546-83-181-15-051136

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    		 3,307
    RFQ
    		546-83-181-15-051136

    Datasheet

         		546 Bulk Active PGA 181 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    144-PGM15025-10

    144-PGM15025-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 2,757
    RFQ
    		144-PGM15025-10

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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