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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    614-93-964-31-002000

    614-93-964-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,279
    RFQ
    		614-93-964-31-002000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    64-9503-20

    64-9503-20

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    		 4,567
    RFQ
    		64-9503-20

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-43-314-61-007000

    116-43-314-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,992
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-314-61-007000

    116-93-314-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,260
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-318-61-105000

    110-93-318-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,323
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-964-31-007000

    614-93-964-31-007000

    SOCKET CARRIER LOWPRO .900 64POS

    Mill-Max Manufacturing Corp.

    		 2,839
    RFQ
    		614-93-964-31-007000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-964-31-007000

    614-43-964-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,223
    RFQ
    		614-43-964-31-007000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-3552-11

    40-3552-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 3,601
    RFQ
    		40-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3553-11

    40-3553-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 3,334
    RFQ
    		40-3553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6551-11

    40-6551-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 3,866
    RFQ
    		40-6551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6552-11

    40-6552-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 4,328
    RFQ
    		40-6552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6553-11

    40-6553-11

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 2,039
    RFQ
    		40-6553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    115-43-650-61-001000

    115-43-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,217
    RFQ

    -

    		 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-650-41-004000

    612-43-650-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,964
    RFQ
    		612-43-650-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-650-41-004000

    612-93-650-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,168
    RFQ
    		612-93-650-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-6574-11

    24-6574-11

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,951
    RFQ
    		24-6574-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3571-11

    24-3571-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 3,251
    RFQ
    		24-3571-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3572-11

    24-3572-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 2,402
    RFQ
    		24-3572-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3573-11

    24-3573-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 3,259
    RFQ
    		24-3573-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3574-11

    24-3574-11

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 4,086
    RFQ
    		24-3574-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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